COOLING APPARATUS HAVING LOW PROFILE EXTRUSION AND METHOD OF MANUFACTURE THEREFORE

Title:

COOLING APPARATUS HAVING LOW PROFILE EXTRUSION AND METHOD OF MANUFACTURE THEREFORE

Document Type and Number:

WIPO Patent Application WO2004061908

Kind Code:

A3

Abstract:

A cooling apparatus has a low profile extrusion (20) with a plurality of micro tubes (21) extended there through. In the caps interconnect the ends of the micro tubes (21) in fluid communications and to inlet (18) and outlet (22) tubes. The low profile extrusion (20) is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes (21) of the low profile extrusion (20), and a heat exchanger (16) removes the heat from the heat transfer fluid.

Inventors:

PARISH OVERTON L IV
DEVILBISS ROGER S

Application Number:

PCT/US2003/041645

Publication Date:

July 28, 2005

Filing Date:

December 30, 2003

Export Citation:

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Assignee:

THERMOTEK INC (US)

International Classes:

B21C23/08; F28D15/02; F28F1/02; H01L23/427; (IPC1-7): B23P6/00; F28F7/00

Foreign References:

US5666819A	1997-09-16
US5029389A	1991-07-09

Other References: