COOLING APPARATUS AND COOLING SYSTEM

Title:

COOLING APPARATUS AND COOLING SYSTEM

Document Type and Number:

WIPO Patent Application WO/2013/161052

Kind Code:

A1

Abstract:

[Problem] To provide a cooling function corresponding to individual electronic apparatus, and to maintain reliability of the electronic apparatus by preventing an operation temperature from being excessively increased. [Solution] A cooling apparatus (1) attached to an electronic apparatus having a heat generating component inside is provided with: a transport pipe (12) having a cooling medium (11) circulating inside; a pump (15), which is connected to the transport pipe (12), and which circulates the cooling medium (11) in the transport pipe (12); a heat exchanging unit, which is connected to the transport pipe (12) and is disposed close to an air inlet of the electronic apparatus, and which exchanges heat with air entered the inside of the electronic component from the air inlet; a cooling unit, which is connected to the transport pipe (12), and which cools the cooling medium (11) circulating in the transport pipe (12); and a control unit, which controls operations of the pump (15), the heat exchanging unit, and the cooling unit. In the cooling apparatus (1), the cooling unit cools the cooling medium (11) that receives heat due to the heat exchange performed by means of the heat exchanging unit.

Inventors:

ARIMOTO YOSHIFUMI (JP)
USUI MASAHIKO (JP)

Application Number:

PCT/JP2012/061358

Publication Date:

October 31, 2013

Filing Date:

April 27, 2012

Export Citation:

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Assignee:

HITACHI LTD (JP)
ARIMOTO YOSHIFUMI (JP)
USUI MASAHIKO (JP)

International Classes:

F25B21/02; H05K7/20

Foreign References:

JP2006032754A	2006-02-02
JP2004194401A	2004-07-08
JPH0697338A	1994-04-08
JP2005228216A	2005-08-25
JP2012054499A	2012-03-15
JP2004319628A	2004-11-11
JPH09283959A	1997-10-31
JP2009295612A	2009-12-17