Title:
COOLING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/079975
Kind Code:
A3
Abstract:
The present invention relates to a cooling apparatus which can simplify the installation and repair of a printed circuit board (PCB) controlling the storing conditions of a non-freezing apparatus. A cooling apparatus includes a cooling space, a non-freezing apparatus which includes an outer casing (110,120) defining the external appearance and which is installed in the cooling space, a PCB controlling an electronic component installed in the non-freezing apparatus, a PCB case receiving the PCB and inserted into the outer casing (110,120) of the non-freezing apparatus, and an opening portion (124) formed in the outer casing (110,120) of the non-freezing apparatus to take the PCB case out.
Inventors:
CHUNG WON-YOUNG (KR)
SOH JAE-HYUN (KR)
KIM CHEOL-HWAN (KR)
KIM JU-HYUN (KR)
SOH JAE-HYUN (KR)
KIM CHEOL-HWAN (KR)
KIM JU-HYUN (KR)
Application Number:
PCT/KR2010/000098
Publication Date:
April 14, 2011
Filing Date:
January 07, 2010
Export Citation:
Assignee:
LG ELECTRONICS INC (KR)
CHUNG WON-YOUNG (KR)
SOH JAE-HYUN (KR)
KIM CHEOL-HWAN (KR)
KIM JU-HYUN (KR)
CHUNG WON-YOUNG (KR)
SOH JAE-HYUN (KR)
KIM CHEOL-HWAN (KR)
KIM JU-HYUN (KR)
International Classes:
F25D11/02; F25D29/00
Domestic Patent References:
| WO1998005911A1 | 1998-02-12 |
Foreign References:
| CA2444074A1 | 2004-04-15 |
Attorney, Agent or Firm:
LEE, Kwang-Yeon (5th Floor New-Seoul Bldg.,828-8, Yoksam 1-Dong, Kangnam-Ku, Seoul 135-935, KR)
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