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Title:
COOLING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/179162
Kind Code:
A1
Abstract:
[Problem] To provide a cooling apparatus that is capable of cooling a heat-generating body with a simple structure. [Solution] A cooling apparatus 1000 is provided with: a casing 100; a substrate 200; and a refrigerant cooling part 300. The casing 100 stores a refrigerant COO that undergoes a phase change between a liquid-phase refrigerant and a gas-phase refrigerant. The substrate 200 is provided in the casing 100, and has heat-generating bodies 210A, 210B mounted thereon. The refrigerant cooling part 300 is provided so as to be connected to the upper side of the substrate 100 in the vertical direction G. The refrigerant cooling part 300 cools the gas-phase refrigerant in the casing 100, and supplies a liquid-phase refrigerant generated through the cooling to the heat-generating body 210B along the substrate 200.

Inventors:
CHIBA MASAKI (JP)
ISHIHARA KUNIHIKO (JP)
WADA MIZUKI (JP)
Application Number:
PCT/JP2017/012997
Publication Date:
October 04, 2018
Filing Date:
March 29, 2017
Export Citation:
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Assignee:
NEC CORP (JP)
International Classes:
H01L23/44; F28D15/02; H05K7/20
Foreign References:
JPH02129999A1990-05-18
JPS6327052U1988-02-22
JPH0244346U1990-03-27
JPS5758877U1982-04-07
Attorney, Agent or Firm:
SHIMOSAKA Naoki (JP)
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