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Patent Searching and Data


Title:
COOLING COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/239419
Kind Code:
A1
Abstract:
In order to make it possible to provide a cooling component which can efficiently cool a portion, of a heating body, heated to a higher temperature without increasing the area of a heat sink, this cooling component includes a first portion corresponding to a first region of the heating body, and a second portion corresponding to a second region of the heating body heated to a higher temperature than the first region, wherein the second portion is provided with a plurality of protruding sections, each of the protruding sections of the second portion forms a flow passage through which a refrigerant flows, and the first portion is not provided with a flow passage.

Inventors:
OCHIAI SYOJI (JP)
Application Number:
PCT/JP2022/009616
Publication Date:
November 17, 2022
Filing Date:
March 07, 2022
Export Citation:
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Assignee:
NEC PLATFORMS LTD (JP)
International Classes:
H01L23/473; H05K7/20
Foreign References:
JP2010010505A2010-01-14
JP2018041978A2018-03-15
JP2015038903A2015-02-26
JPH08181396A1996-07-12
US6118656A2000-09-12
JP2021082123A2021-05-27
Attorney, Agent or Firm:
KITAJIMA Hiroshi et al. (JP)
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