Title:
COOLING COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/259770
Kind Code:
A1
Abstract:
In order to make it possible to provide a cooling component which can substantially uniformly cool a cooling target object, this cooling component comprises: a heat receiving plate that receives heat from the cooling target object; a plurality of heat dissipating plates disposed at predetermined intervals on the heat receiving plate; a refrigerant supplying means for supplying a refrigerant to the plurality of heat dissipating plates; a refrigerant discharging means to which the refrigerant is supplied from the plurality of heat dissipating plates; and a refrigerant passing member in which a plurality of through-holes through which the refrigerant passes are formed, wherein the refrigerant supplied by the refrigerant supplying means passes through some of the through-holes, while the refrigerant that passes through the remainder of the plurality of through-holes is discharged by the refrigerant discharging means, and some of the plurality of through-holes and the remainder of the plurality of through-holes are adjacent to each other.
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Inventors:
NAKAMURA YASUHITO (JP)
Application Number:
PCT/JP2022/018252
Publication Date:
December 15, 2022
Filing Date:
April 20, 2022
Export Citation:
Assignee:
NEC PLATFORMS LTD (JP)
International Classes:
H05K7/20; H01L23/473
Domestic Patent References:
| WO2019043801A1 | 2019-03-07 |
Foreign References:
| JP2014183260A | 2014-09-29 | |||
| JP2007142390A | 2007-06-07 | |||
| JP2019160831A | 2019-09-19 | |||
| JP2021097539A | 2021-06-24 |
Attorney, Agent or Firm:
KITAJIMA Hiroshi et al. (JP)
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