Title:
COOLING DEVICE AND ELECTRONIC DEVICE PROVIDED WITH COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/111205
Kind Code:
A1
Abstract:
Provided are: a cooling device that makes it possible to achieve sufficient cooling performance even within a thin electronic device; and an electronic device that is provided with the cooling device. The cooling device is provided with: a heat reception unit that vaporizes a refrigerant; a condensation unit that condenses the vaporized refrigerant and that comprises a vapor tube through which the vaporized refrigerant moves, an inclined section that has inclines in at least two directions, and at least two members that are connected to the inclines; and a liquid tube through which the condensed liquid refrigerant moves.
Inventors:
SUZUKI KAZUAKI (JP)
TSUBAKI SHIGEYASU (JP)
SATOU SHIGEMASA (JP)
TSUBAKI SHIGEYASU (JP)
SATOU SHIGEMASA (JP)
Application Number:
PCT/JP2014/051607
Publication Date:
July 30, 2015
Filing Date:
January 27, 2014
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
F28D15/02; H01L23/427
Domestic Patent References:
| WO2013018667A1 | 2013-02-07 | |||
| WO2013073696A1 | 2013-05-23 | |||
| WO2013102973A1 | 2013-07-11 |
Foreign References:
| JP2010045088A | 2010-02-25 | |||
| JP2011047616A | 2011-03-10 | |||
| JP2013004562A | 2013-01-07 |
Attorney, Agent or Firm:
INOUE, Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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