Title:
COOLING DEVICE AND METHOD FOR PRODUCING A COOLING DEVICE AND CIRCUIT ASSEMBLY HAVING A COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/016085
Kind Code:
A3
Abstract:
The invention relates to a cooling device (100) for a circuit (200) having a support part (120) for holding the circuit (200) and a cooling element (110) for holding the support part (120) and a metalliferous boundary layer (130a), infiltrated in the support part (120) and/or the cooling element (110), between the support part (120) and the cooling element (110), which connects the support part (120) and the cooling element (110) in a firmly bonded, planar manner, and serves to compensate for the differing thermal expansions of the support part (120) and the cooling element (110) and for thermal transfer from the support part (120) to the cooling element (110). Said cooling device is efficient and cost-effective, and ensures error-free functionality of the circuit, despite strong temperature fluctuations.
Inventors:
BAEUMEL HERMANN (DE)
FETZER JOHANNES (DE)
JESINGER GUENTHER (DE)
FETZER JOHANNES (DE)
JESINGER GUENTHER (DE)
Application Number:
PCT/EP2013/063962
Publication Date:
March 27, 2014
Filing Date:
July 02, 2013
Export Citation:
Assignee:
CONTI TEMIC MICROELECTRONIC (DE)
International Classes:
H01L23/373; H01L23/367
Domestic Patent References:
| WO2009092480A1 | 2009-07-30 | |||
| WO2005109980A1 | 2005-11-17 |
Foreign References:
| US5981085A | 1999-11-09 | |||
| DE102010001565A1 | 2011-08-04 | |||
| DE10245266A1 | 2004-04-15 | |||
| US6245442B1 | 2001-06-12 | |||
| US5965193A | 1999-10-12 | |||
| JPH08191120A | 1996-07-23 |
Attorney, Agent or Firm:
BONN, Roman (Postfach 22 16 39, München, DE)
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