Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COOLING DEVICE AND COOLING METHOD FOR REFRACTORY FURNACE WALLS
Document Type and Number:
WIPO Patent Application WO/2010/150860
Kind Code:
A1
Abstract:
Disclosed are a cooling device for refractory furnace walls and a cooling method using said device, which curb the speed of erosion within a furnace, improve the durability of refractory material and extend the life of refractory furnace walls. Said cooling device (1) and cooling method use a refractory material (2), constituting a heat resistant furnace wall made from electroformed bricks or similar; a metal sheet (4) for cooling, fused onto both sides of the refractory material (2) by means of a low melting point metal (3), which has a melting point of 100-500℃; and a cooling means (5) for cooling the refractory material (2) by means of cooling the aforementioned metal sheet (4).

Inventors:
HIGASHI, Katsumi (Co. Ltd., 6-1, Umei 5-chome, Takasago-sh, Hyogo 55, 〒6768655, JP)
東 勝美 (〒55 兵庫県高砂市梅井5丁目6番1号 AGCセラミックス株式会社内 Hyogo, 〒6768655, JP)
UEDA, Hiroshi (Co. Ltd., 6-1, Umei 5-chome, Takasago-sh, Hyogo 55, 〒6768655, JP)
植田 宏 (〒55 兵庫県高砂市梅井5丁目6番1号 AGCセラミックス株式会社内 Hyogo, 〒6768655, JP)
KANDA, Kouichi (Co. Ltd., 6-1, Umei 5-chome, Takasago-sh, Hyogo 55, 〒6768655, JP)
Application Number:
JP2010/060786
Publication Date:
December 29, 2010
Filing Date:
June 24, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AGC CERAMICS CO., LTD. (1-23, Shiba 4-chome Minato-k, Tokyo 14, 〒1080014, JP)
AGCセラミックス株式会社 (〒14 東京都港区芝4丁目1番23号 Tokyo, 〒1080014, JP)
HIGASHI, Katsumi (Co. Ltd., 6-1, Umei 5-chome, Takasago-sh, Hyogo 55, 〒6768655, JP)
東 勝美 (〒55 兵庫県高砂市梅井5丁目6番1号 AGCセラミックス株式会社内 Hyogo, 〒6768655, JP)
UEDA, Hiroshi (Co. Ltd., 6-1, Umei 5-chome, Takasago-sh, Hyogo 55, 〒6768655, JP)
植田 宏 (〒55 兵庫県高砂市梅井5丁目6番1号 AGCセラミックス株式会社内 Hyogo, 〒6768655, JP)
International Classes:
F27D1/12; B23K35/26; B23K35/28; C22C12/00; C22C13/00; C22C18/00; C22C18/02; C22C28/00
Attorney, Agent or Firm:
SENMYO, Kenji et al. (4th Floor, SIA Kanda Square17, Kanda-konyach, Chiyoda-ku Tokyo 35, 〒1010035, JP)
Download PDF: