Title:
COOLING DEVICE AND COOLING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/108387
Kind Code:
A1
Abstract:
A cooling device is provided with a transfer means for transferring a resin composition formed into a sheet shape in the surface direction, and a cooling means for cooling the resin composition transferred by the transfer means. The resin composition has a temperature of 40 to 60°C just before being cooled by the cooling means, and the cooling means has a cooling capability of cooling the resin composition at a cooling speed of 0.2 to 5°C/second. Further, the cooling means comprises a blowing unit having at least one exhaust port from which cold air of -40 to 0°C is discharged toward the resin composition.
Inventors:
UEDA Shigehisa (5-8 Higashi-shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
上田 茂久 (〒02 東京都品川区東品川２丁目５番８号 住友ベークライト株式会社内 Tokyo, 〒1400002, JP)
上田 茂久 (〒02 東京都品川区東品川２丁目５番８号 住友ベークライト株式会社内 Tokyo, 〒1400002, JP)
Application Number:
JP2011/053698
Publication Date:
September 09, 2011
Filing Date:
February 21, 2011
Export Citation:
Assignee:
SUMITOMO BAKELITE COMPANY LIMITED (5-8 Higashi-shinagawa 2-chome, Shinagawa-ku Tokyo, 02, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
UEDA Shigehisa (5-8 Higashi-shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
UEDA Shigehisa (5-8 Higashi-shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
International Classes:
B29B13/04; B29B9/04; B29B11/06; B29C43/22; B29C43/46; B29C43/52
Attorney, Agent or Firm:
ASAHI Kazuo et al. (Nishi-Shinbashi Noa Bldg. 4th Floor, 18-9 Nishi-Shinbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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Claims:
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