Title:
COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/078796
Kind Code:
A1
Abstract:
A cooling device (1) is provided with a cooler (2), a radiator (3), a heat-transfer body (5) and an insulation material (6). The cooler (2) has a heat-dissipating surface (2a) and a cooling surface (2b). The radiator (3) is provided on the heat-dissipating surface (2a). The heat-transfer body (5) is provided with a first heat-transfer part (8), a second heat-transfer part (9) and a third heat-transfer part (10). The first heat-transfer part (8) is provided on the cooling surface (2b). The third heat-transfer part (10) connects the first heat-transfer part (8) and the second heat transfer-part (9). The insulation material (6) covers at least the first heat-transfer part (8).
Inventors:
OCHIAI YASUTAKA (JP)
HAMADA MAMORU (JP)
MORII AKIRA (JP)
ITO YUICHIRO (JP)
IZUMO YOSUKE (JP)
TAKANO KOSHIRO (JP)
ARATSU YURIKO (JP)
HAMADA MAMORU (JP)
MORII AKIRA (JP)
ITO YUICHIRO (JP)
IZUMO YOSUKE (JP)
TAKANO KOSHIRO (JP)
ARATSU YURIKO (JP)
Application Number:
PCT/JP2016/082067
Publication Date:
May 03, 2018
Filing Date:
October 28, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F25B21/02; F25D11/00; H01L35/30
Domestic Patent References:
| WO2015125790A1 | 2015-08-27 |
Foreign References:
| JP2004022603A | 2004-01-22 | |||
| JPH11177264A | 1999-07-02 | |||
| JP2001148961A | 2001-06-05 | |||
| JP2002139264A | 2002-05-17 | |||
| JP2001221551A | 2001-08-17 | |||
| JPH10110961A | 1998-04-28 |
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
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