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Patent Searching and Data


Title:
COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/131834
Kind Code:
A1
Abstract:
Provided is a cooling device capable of improving bonding reliability between a base block and a heat pipe, while reducing environmental load, and capable of achieving both excellent contact heat transfer coefficient and vibration resistance. A cooling device (1) is provided with: a base block (10) having a rear surface section (10a) thermally connected to an electric component (300), i.e., a heat generating body; a heat pipe group (20) comprising a plurality of heat pipes (21) each having a first cylindrical section (21a), which is fixed to a front surface section (10b) of the base block (10), and which is disposed in the in-plane direction of the base block (10), and a second cylindrical section (21b), which is connected to the first cylindrical section (21a), and which stands from the base block (10); and a fin group (30) comprising a plurality of fins (31, 31, and so on) that are fixed by being aligned in parallel to each other in the standing direction of the heat pipe group (20).

Inventors:
SASAKI CHIYOSHI (JP)
ISEMURA MASAKAZU (JP)
KATAYAMA TAKAHIRO (JP)
Application Number:
PCT/JP2018/048047
Publication Date:
July 04, 2019
Filing Date:
December 27, 2018
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
F28D15/02
Domestic Patent References:
WO1999039145A11999-08-05
WO2017077619A12017-05-11
WO2016104729A12016-06-30
WO2017077619A12017-05-11
Foreign References:
JP2004125381A2004-04-22
JP2007218439A2007-08-30
JPH11351769A1999-12-24
CN2560098Y2003-07-09
US20070029072A12007-02-08
CN2736931Y2005-10-26
US20080121378A12008-05-29
CN207976030U2018-10-16
JP2004125381A2004-04-22
Other References:
See also references of EP 3734214A4
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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