Title:
COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/208726
Kind Code:
A1
Abstract:
A cooling device provided with: at least one evaporation unit (14) that causes a liquid-phase refrigerant to boil by causing heat to move from an object to be cooled to the liquid-phase refrigerant; a condensation unit (16) that condenses a gas-phase refrigerant; a liquid-refrigerant pipe (18) for circulating the liquid-phase refrigerant from the condensation unit to the at least one evaporation unit; a gas refrigerant pipe (20) for circulating the gas-phase refrigerant from the at least one evaporation unit to the condensation unit; and a communicating pipe (24) which includes a first connection unit (24a) connected to the gas refrigerant pipe or the at least one evaporation unit, and a second connection unit (24b) which is connected to the liquid-refrigerant pipe or the at least one evaporation unit and positioned on the lower side with respect to the first connection unit in the direction of gravitational force. When, as the liquid-phase refrigerant boils, air bubbles generated from the liquid-phase refrigerant in the at least one evaporation unit cause the liquid-phase refrigerant to move toward the condensation unit side, the liquid-phase refrigerant is caused to move from the first connection unit to the second connection unit through the communicating pipe before the liquid-phase refrigerant that has moved reaches the condensation unit.
Inventors:
MIURA KOJI (JP)
OMI YASUMITSU (JP)
YOSHINORI TAKESHI (JP)
TAKEUCHI MASAYUKI (JP)
OMI YASUMITSU (JP)
YOSHINORI TAKESHI (JP)
TAKEUCHI MASAYUKI (JP)
Application Number:
PCT/JP2019/017773
Publication Date:
October 31, 2019
Filing Date:
April 25, 2019
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
F28D15/02; B60K11/02; H01M10/613
Domestic Patent References:
| WO2018070116A1 | 2018-04-19 | |||
| WO2017051525A1 | 2017-03-30 |
Foreign References:
| JP2902068B2 | 1999-06-07 | |||
| JPH03213998A | 1991-09-19 | |||
| JPS6215661Y2 | 1987-04-21 | |||
| JP2005055079A | 2005-03-03 | |||
| JPH0631704B2 | 1994-04-27 | |||
| JP2012241976A | 2012-12-10 | |||
| JP2009168273A | 2009-07-30 | |||
| JP2005188813A | 2005-07-14 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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