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Patent Searching and Data


Title:
COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/004258
Kind Code:
A1
Abstract:
This cooling device comprises: a heating unit in which a storage space for storing a refrigerant in a liquid phase is provided, and which is thermally connected to a heat-generating body and has a heat transfer surface for transmitting the heat of the heat-generating body to the refrigerant; a refrigerant discharge pipe which is connected to the heating unit to discharge the refrigerant from the storage space; a cooling unit which is connected to the refrigerant discharge pipe to cool the refrigerant discharged from the heating unit; a refrigerant supply pipe which connects the cooling unit and the heating unit to supply the refrigerant cooled in the cooling unit to the heating unit; and a negative-pressure adjustment unit which produces a negative pressure in the storage space and is capable of adjusting the inner pressure of the storage space.

Inventors:
HARA NOBUHIDE (JP)
OTANI YUICHI (JP)
Application Number:
PCT/JP2023/005528
Publication Date:
January 04, 2024
Filing Date:
February 16, 2023
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
H01L23/427; F28D15/02; G06F1/20; H05K7/20
Foreign References:
JP2020107785A2020-07-09
JP2020119976A2020-08-06
JP2010026134A2010-02-04
JP2008021697A2008-01-31
JP2004190928A2004-07-08
JP2014183107A2014-09-29
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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