Title:
COOLING AND HEATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/140800
Kind Code:
A1
Abstract:
A cooling and heating device uses heat due to emission and radiation generated at walls and windows of a building and a moving vehicle, and copper ultrafine particles as transparent metal and ultrafine particles produced from tin oxide or indium oxide as an n-type semiconductor are deposited on the inner surfaces of the walls and the windows. At least one or more Thomson elements each configured from metal, an n-type semiconductor, and metal are disposed in a polymer film or a Thomson element configured from a carbon nanotube structure cell, a degenerate semiconductor wafer, and a carbon nanotube structure cell is disposed to thereby cause heat absorption or heat generation due to a difference in thermoelectric power (Seebeck coefficient) in the flow direction of an electric current in the voltage application direction of the Thomson element.
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Inventors:
WATANABE TAKAYA (JP)
Application Number:
PCT/JP2011/074622
Publication Date:
October 18, 2012
Filing Date:
October 26, 2011
Export Citation:
Assignee:
WATANABE TAKAYA (JP)
International Classes:
F24F1/00; B60H1/32; F25B21/02; F25B21/04; H01L35/22; H01L35/32
Domestic Patent References:
WO2008146689A1 | 2008-12-04 |
Foreign References:
JPH07139750A | 1995-05-30 | |||
JP2003229607A | 2003-08-15 | |||
JP2009259806A | 2009-11-05 | |||
JPS6242470A | 1987-02-24 | |||
JP2005235831A | 2005-09-02 | |||
JP2009527643A | 2009-07-30 | |||
JPH03114467U | 1991-11-25 | |||
JP2004273489A | 2004-09-30 | |||
JP2008060488A | 2008-03-13 | |||
JP2000269561A | 2000-09-29 | |||
JP2006135074A | 2006-05-25 | |||
JP2005101191A | 2005-04-14 |
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