Title:
COOLING MECHANISM FOR DATA CENTER
Document Type and Number:
WIPO Patent Application WO/2014/126005
Kind Code:
A1
Abstract:
[Problem]
To develop a novel data center cooling mechanism which can be operated at a low running cost, and with which the infiltration of dirt and dust, the generation of water droplets, and water leakage can be eliminated, and temperature variations in the spaces in a room can be reduced, and with which a fire can be extinguished quickly and with little damage when a fire occurs.
[Solution]
A data center cooling mechanism characterized in that an evaporative condenser and a liquid receiver are arranged outside of a data center room, an evaporator is arranged in a space inside the data center room, and the space inside the room is cooled by evaporation of a refrigerant in the evaporator, with the refrigerant being condensed by the evaporative condenser.
Inventors:
SHIRAIWA HIROYUKI (JP)
KANEO HIDETOSHI (JP)
KANEO HIDETOSHI (JP)
Application Number:
PCT/JP2014/052854
Publication Date:
August 21, 2014
Filing Date:
February 07, 2014
Export Citation:
Assignee:
HACHIYO ENGINEERING CO LTD (JP)
INST NAT COLLEGES TECH JAPAN (JP)
INST NAT COLLEGES TECH JAPAN (JP)
International Classes:
F24F7/06; F25B1/00; F25B1/053; F25B39/02
Foreign References:
| JP2003240360A | 2003-08-27 | |||
| JP2012102946A | 2012-05-31 | |||
| JP2008175522A | 2008-07-31 | |||
| JP2006329601A | 2006-12-07 | |||
| JP2005030622A | 2005-02-03 | |||
| JP2008209111A | 2008-09-11 | |||
| JP2007024442A | 2007-02-01 | |||
| JPH08219473A | 1996-08-30 | |||
| JP2009121269A | 2009-06-04 |
Attorney, Agent or Firm:
HIGASHIYAMA TAKAHIKO (JP)
Takahiko Higashiyama (JP)
Takahiko Higashiyama (JP)
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