Title:
COOLING MODULE
Document Type and Number:
WIPO Patent Application WO/2024/014491
Kind Code:
A1
Abstract:
This cooling module comprises a resin manifold composed of a plurality of housings that have joint portions joined to each other. The manifold includes a plurality of flow passageways that are formed across at least two of the plurality of housings. The joint surface of each of the joint portions of the two of the plurality of housings that are joined to each other is an end surface of a partition wall that partitions the interior of the housings into the plurality of flow passageways and a plurality of preliminary chambers. The partition wall rises from the bottom surface of each of the two housings.
Inventors:
ISHII MASATO (JP)
YANO HIDETO (JP)
ESAKI YASUHIKO (JP)
YANO HIDETO (JP)
ESAKI YASUHIKO (JP)
Application Number:
PCT/JP2023/025774
Publication Date:
January 18, 2024
Filing Date:
July 12, 2023
Export Citation:
Assignee:
AISIN CORP (JP)
International Classes:
B60K1/00; B60K11/02
Domestic Patent References:
| WO2020008822A1 | 2020-01-09 |
Foreign References:
| US3707163A | 1972-12-26 | |||
| JP2019051927A | 2019-04-04 | |||
| JPH05136305A | 1993-06-01 | |||
| JPH11220191A | 1999-08-10 |
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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