Title:
COOLING PAD
Document Type and Number:
WIPO Patent Application WO/2005/066740
Kind Code:
A1
Abstract:
A small, lightweight, easy-to-carry, high-cooling-efficiency cooling pad used for notebook-size personal computers or game machines by being set under them, characterized in that a metallic heat transfer plate is superposed at least on the upper surface of a resin bag encapsulating an endothermic gel material containing an inorganic hydrate crystal having a melting temperature zone of 30°C or thereabout, and then they are further packaged by a resin bag.
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Inventors:
SATO KEIJI (JP)
Application Number:
PCT/JP2004/008977
Publication Date:
July 21, 2005
Filing Date:
June 25, 2004
Export Citation:
Assignee:
TAMAI KASEI CO LTD (JP)
KATSUZAI CHEMICALS CORP (JP)
SATO KEIJI (JP)
KATSUZAI CHEMICALS CORP (JP)
SATO KEIJI (JP)
International Classes:
C09K5/06; G06F1/20; (IPC1-7): G06F1/20; C09K5/00; C09K5/06; F25D3/00; H05K7/20
Foreign References:
| JP2000347770A | 2000-12-15 | |||
| JPH1192756A | 1999-04-06 | |||
| JPH0860142A | 1996-03-05 | |||
| JPS6225188A | 1987-02-03 | |||
| JP2001147737A | 2001-05-29 | |||
| JP2002111258A | 2002-04-12 | |||
| JPH088567A | 1996-01-12 | |||
| JP2003268360A | 2003-09-25 | |||
| JPS60203689A | 1985-10-15 |
Attorney, Agent or Firm:
Naemura, Shinichi (5-36 Kinko-cho, Kanagawa-k, Yokohama-shi Kanagawa 56, JP)
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