[0001 ] The invention relates to a cooling station and a method according to the generic terms of the independent patent claims.

[0002] In the production of baked products - in particular, in the production of multi-layered wafer products with intermediate layers of an edible creme - it is often necessary to cool the baked products or intermediate baked products.

[0003] For example, in the production of wafer slices, individual wafer sheets that come from an industrial production line for baking wafer sheets are to be provided with an edible creme on their upper side. This edible creme is, for example, a chocolate and/or hazelnut creme that is warmed up in order to be able to apply it efficiently to the wafer sheets. In order to be able to stack several such wafer sheets provided with creme, it is necessary to cool down the applied creme sufficiently. The wafer sheets of freshly-formed wafer blocks that are still warm and therefore soft may also need to be cooled.

[0004] Modern production plants for the formation of such wafer products usually operate continuously or intermittently, wherein a constant product flow must be maintained. In order to have sufficient time for cooling the intermediate products, it is known to convey wafer sheets, which may be assembled into wafer blocks, one after the other through a cooling chamber via a spiral conveyor. However, the disadvantage of these spiral coolers is that they take up a relatively large amount of space and also have a complicated design.

[0005] For cooling wafer sheets that are not yet provided with a creme, it is known to convey them vertically in trays. In particular, the trays are attached to a wafer sheet conveyor, which extends substantially along a vertical axis and conveys the wafer sheets upwards in an ascending part and downwards again in a descending part, in order to then subsequently place them on a conveyor belt, such that the wafer sheets can be fed to a further processing station. With this structure, the trays are pivoted 180° at the upper deflection point of the wafer sheet conveyor in order to be conveyed down again. In the same manner, the wafer sheets resting on the trays are turned by 180° at the upper deflection point of the wafer sheet conveyor, such that they are deposited in the descending region on the surface previously facing upwards. The advantage of this design is that it is relatively simple and requires little space. However, this design is not suitable for cooling wafer sheets provided with a creme on one side, since the sheets would rest with their creme side on the trays when turned in the upper region, which would damage the intermediate products and contaminate the cooling device. Moreover, wafer sheets assembled into a wafer block cannot be cooled without damage with such a design, since the freshly-formed wafer blocks, which are still warm, are highly fragile. In addition, wafer blocks can also be provided with a creme on one side.

[0006] It is, then, the object of the invention to provide a cooling station and method for cooling wafer sheets that are of simple structure, which have a small space requirement, but which nevertheless permit high-quality and substantially damage-free cooling.

[0007] The object according to the invention is achieved in particular by the features of the independent claims.

[0008] In particular, the invention relates to a cooling station for cooling wafer sheets, comprising:

- a cooling region for cooling the wafer sheets,

- a wafer sheet conveyor, extending through the cooling region, for transporting the wafer sheets,

- a transfer region, for transferring the wafer sheets to the wafer sheet conveyor,

- a pickup region, for picking up the wafer sheets from the wafer sheet conveyor, - a first conveying section of the wafer sheet conveyor, in which the wafer sheets are conveyed upwards in a manner substantially parallel and spaced apart one above the other,

- a second conveying section of the wafer sheet conveyor, in which the wafer sheets are conveyed downwards in a manner substantially parallel and spaced apart one above the other,

- a first deflecting section, in which the wafer sheet conveyor is deflected from the first conveying section to the second conveying section,

- a second deflecting section, in which the wafer sheet conveyor is deflected from the second conveying section back to the first conveying section.

[0009] Thereby, the wafer sheets may be provided with a creme and/or assembled into a wafer block.

[0010] Wafer blocks are multilayer wafer intermediates that have several wafer sheet layers and creme layers arranged between the layers. The creme layers are formed, for example, from a nut and/or chocolate creme. Such wafer blocks, after stacking and cooling, are usually cut, packaged, and sold as cut products.

[0011 ] Preferably, a displacement device is provided, which displaces the wafer sheets transversely to the course of the wafer sheet conveyor from one conveying section of the wafer sheet conveyor - in particular, from the first conveying section - to the other conveying section - in particular, to the second conveying section.

[0012] Preferably, the displacement device displaces the wafer sheets or wafer blocks transversely to the course of the wafer conveyor from the upwards conveying section to the downwards conveying section. [0013] If applicable, it is provided that the displacement device transport the wafer sheets in the end region of one conveying section into the start region of the other conveying section.

[0014] If applicable, it is provided that the displacement device transport the wafer sheets in the end region of the first conveying section into the start region of the second conveying section.

[0015] If applicable, it is provided that the wafer sheet conveyor be configured for transporting wafer sheets provided with a creme on one side, and the displacement device be designed in such a manner that, during transport through the cooling station, the wafer sheets are transported individually and always with their side, provided with the creme, facing upwards.

[0016] If applicable, the first conveying section and the second conveying section are provided to extend substantially vertically and parallel to one another.

[0017] If applicable, it is provided that the displacement device be configured for displacing at least one wafer sheet, and preferably two, three, four, five, or more wafer sheets, from one conveying section to the other conveying section during a slide operation.

[0018] If applicable, it is provided that the wafer sheet conveyor have several substantially horizontally-extending trays, on which trays the wafer sheets are transported in a lying position. If applicable, it is provided that each tray transport only one wafer sheet or one wafer block.

[0019] If applicable, it is provided that the displacement device displace the trays together with the wafer sheets or wafer blocks supported on the trays when transporting the wafer sheets from one conveying section to the other conveying section. [0020] If applicable, the wafer sheet conveyor is provided with several holding devices for holding the trays on the wafer sheet conveyor,

- wherein the holding devices are preferably designed in such a manner that, in the region of the displacement device, they enable the trays to be displaced transversely to the course of the wafer sheet conveyor from a holding device of one conveying section into a holding device of the other conveying section.

[0021 ] If applicable, a holding mechanism is provided, which prevents the trays from falling out of the holding devices, but allows the trays to be displaced by the displacement device.

[0022] If applicable, it is provided that the holding mechanism for removing a tray be formed to be releasable - in particular, releasable without tools.

[0023] If applicable, it is provided that the holding devices in the first conveying region and in the second conveying region be substantially horizontally- extending, rail-shaped, or groove-shaped guides.

[0024] If applicable, it is provided that, in the region of the displacement device, between the first conveying section and the second conveying section, a guide device be provided, which guides the trays during the displacement operation in each case from the holding device of one conveying section in the direction of and/or into the holding device of the other conveying section.

[0025] If applicable, it is provided that the trays each have one or more outwardly-projecting, finger-shaped tray sections that engage between one or more conveying elements in the transfer region and/or in the pickup region, in order to receive or deposit a wafer sheet.

[0026] In particular, the invention relates to a method for cooling wafer sheets

- if applicable, provided with a creme and/or assembled into wafer blocks - in particular, in a cooling station according to the invention - comprising the following steps:

- transporting wafer sheets into a first conveying section of a wafer sheet conveyor in a first direction along a vertical axis,

- thereafter, transporting the wafer sheets into a second conveying section of the wafer sheet conveyor in a second direction along a vertical axis substantially opposite to the first direction,

- cooling the wafer sheets during transport along the wafer sheet conveyor.

[0027] In particular, the cooling station and the method are suitable and/or configured for cooling wafer sheets provided with a creme - for example, wafer sheets provided with a creme on one side or wafer sheets provided with a creme and assembled to form a wafer block.

[0028] Preferably, the wafer sheets, which may be provided with a creme and/or assembled into wafer blocks, are displaced by a displacement device transversely to the course of the wafer sheet conveyor from the first conveying section to the second conveying section.

[0029] If applicable, it is provided that the wafer sheets be transported during transport through the cooling station individually and always with their side, provided with the creme, facing upwards.

[0030] If applicable, it is provided that the wafer sheet conveyor be stopped as soon as the desired number of wafer sheets are located in the region of the displacement device, that the displacement device displace the wafer sheet or sheets in a displacement operation from the first conveying section to the second conveying section when the wafer sheet conveyor is stopped, and that the wafer sheet conveyor be subsequently moved further in order to convey further wafer sheets into the displacement region. [0031 ] If applicable, it is provided that the wafer sheets be displaced horizontally by the displacement device.

[0032] If applicable, it is provided that the displacement device displace at least one wafer sheet, and preferably two, three, four, five, or more wafer sheets, from one conveying section to the other conveying section during a slide operation.

[0033] According to a preferred embodiment, it is provided that the wafer sheets be transferred to the wafer sheet conveyor, subsequently conveyed upwards in the first conveying section of the wafer sheet conveyor, thereafter conveyed downwards in the second conveying section of the wafer sheet conveyor, and cooled in the process. In principle, however, it can also be provided alternatively that the wafer sheets be first transferred to a second conveying section of the wafer sheet conveyor, which conveys the wafer sheets downwards, and that thereafter the wafer sheets be conveyed upwards in the first conveying section. If applicable, in all embodiments, the wafer sheet conveyor is a vertical conveyor.

[0034] Preferably, it is provided that the wafer sheets - if applicable, provided with the creme - be cooled during the movement along or through the wafer sheet conveyor.

[0035] In particular, it is provided that the wafer sheet conveyor be provided at least partially within a housing. Preferably, cooling is provided - in particular, active cooling - by which the wafer sheets and preferably the interior of a housing are cooled.

[0036] Preferably, the displacement device is provided in the end region of one conveying section and transports the wafer sheets into the start region of the other conveying section. In particular, the displacement device is arranged or acts immediately upstream of and downstream of a deflecting section. As a result, the entire length of the conveying sections of the wafer sheet conveyor can be utilized. According to the preferred embodiment, the displacement device acts immediately upstream of and downstream of the first deflecting section.

[0037] Due to the special design of the displacement device, the wafer sheets are always transported with their side, provided with creme, facing upwards. Preferably, it is provided that the first conveying section and the second conveying section extend substantially vertically and parallel to one another. Alternatively, however, it is also possible to provide for the conveying sections to extend diagonally upwards or downwards.

[0038] Preferably, it is provided that the displacement device displace at least one wafer sheet, and preferably two, three, four, five, or more wafer sheets, from one conveying section to the other conveying section. In particular, to displace the wafer sheets, the tray or trays are displaced by the displacement device.

[0039] If applicable, it is provided that the wafer sheet conveyor transport the wafer sheets to the displacement device. The wafer sheet conveyor is stopped in the region of the displacement device. The stopped trays or wafer sheets are then moved from one conveying section to the other conveying section when the wafer sheet conveyor is stopped and not moving. Such displacement takes place transversely to the course of the wafer sheet conveyor in the region of the displacement device, and in particular horizontally.

[0040] Subsequently, the wafer sheet conveyor is moved further until the next wafer sheets are arranged in the region of the displacement device, in order to then displace them from one conveying section to the other conveying section in an analogous manner. [0041 ] The transport of the wafer sheets in the first conveying section and/or in the second conveying section preferably takes place in a straight line - in particular, vertically. The wafer sheets are, during transport, preferably held horizontally in the first conveying section and/or in the second conveying section.

[0042] Preferably, during the displacement operation of the wafer sheet conveyor, the holding devices are aligned with one another so that a tray can be moved from one holding device in the first conveying section to another holding device in the conveying section. Preferably, in all embodiments, it is provided that several wafer sheets, and thus, if applicable, several trays, be displaced simultaneously during one displacement operation.

[0043] For example, the displacement device can comprise a drive - particularly a linear drive such as a servo-linear axis, a ball screw, a rack-and- pinion axis, an electric cylinder or drive, a hydraulic cylinder, a pneumatic cylinder, or similar drive - which acts on the trays via a slide bar. The drive of the displacement device is preferably coupled to the controller of the wafer sheet conveyor to perform the displacement operation if the wafer sheet conveyor is stopped in the correct position.

[0044] Preferably, it is provided that the wafer sheets, with their creme side facing upwards, be transported in a lying position on the trays. Preferably, the cooling station and in particular the wafer sheet conveyor comprise a plurality of trays. Preferably, only one wafer sheet is conveyed on each tray. Preferably, one wafer sheet is placed on each tray.

[0045] Preferably, no wafer sheets are arranged on the trays in the first deflecting section and in the second deflecting section. In particular, the wafer sheets are either displaced by the displacement device upstream of the deflecting regions, or picked up from the trays in the pickup region. Preferably, the transfer region is arranged downstream of a deflecting section. [0046] Preferably, the trays each have one or more outwardly-projecting, finger-shaped tray sections. Such finger-shaped tray sections are suitable and/or configured for removing the wafer sheets from a conveying device for feeding the wafer sheets and/or for depositing the wafer sheets onto a conveying device for transporting away the wafer sheets. In particular, conveying devices are provided, which comprise finger-shaped conveyor extensions at their ends associated with or turned towards the cooling station. The finger-shaped tray sections protrude between the finger-shaped extensions of the conveying devices and are moved through them in a comblike manner, in order to remove and/or deposit the wafer sheets.

[0047] If applicable, the trays have a central connecting bar from which finger- shaped tray sections project on both sides. In particular, it may be necessary to provide tray sections projecting on both sides, since the trays are moved from one conveying section to the other, and therefore must be provided with finger-shaped tray sections on both sides.

[0048] In particular, the method for cooling wafer sheets provided with a creme on one side can proceed as follows:

[0049] The wafer sheets, provided with a creme on one side, are fed to the cooling station via a conveying device. If applicable, each wafer sheet is stopped in the region of the cooling station. Subsequently, the wafer sheet is transferred to the wafer sheet conveyor. This takes place in particular by finger- shaped, outwardly-projecting tray sections gripping the wafer sheet from below and lifting it off the conveying device. Subsequently, the wafer sheet is moved along the wafer sheet conveyor with the creme layer facing upwards. In particular, it is moved along two conveying sections, wherein one conveying section is an upwardly-extending conveying section, and another conveying section is a downwardly-extending conveying section. This arrangement in particular enables space-saving and efficient cooling. [0050] In order to prevent the wafer sheets from being turned 180° at the upper deflection point - in particular, in the deflecting region of the wafer sheet conveyor - the method preferably comprises the following steps:

[0051 ] In the region of a displacement device, the wafers are displaced from one conveying section to the other conveying section. This takes place upstream of the deflecting section. The wafer sheets are displaced transversely to the course of the wafer sheet conveyor, and preferably horizontally. This allows the wafer sheets to always be conveyed through the cooling region with their side provided with creme facing upwards. The wafer sheets are transported from one conveying section to the other upstream of the deflecting region, such that no wafer sheets rest or are arranged on the trays in the deflecting section.

[0052] Subsequently, the wafer sheets are conveyed further along the wafer sheet conveyor, and thus cooled further.

[0053] The wafer sheets are further conveyed to a pickup region. There, the wafer sheets are preferably deposited on a conveying device are and transported further away.

[0054] Preferably, the wafer sheet conveyor is stationary or remains motionless if the displacement device displaces the wafer sheets transversely to the course of the wafer sheet conveyor.

[0055] Preferably, the wafer sheets are baked in an industrial production plant for the production of wafer sheets and subsequently provided with a creme layer in a spreading station. Such wafer sheets, provided with a creme layer on one side, are then fed to the cooling station. [0056] Preferably, the cooled wafer sheets provided with a creme are subsequently fed to a stacking device, in which several wafer sheets and creme layers are stacked on top of one another in layers. Subsequently, such layered blocks can be cut and packaged in order to form baked products.

[0057] For example, the cooling station can comprise 100 to 300 trays. For example, the cooling time is 10 to 30 minutes, and preferably 15 to 20 minutes. For example, the cooling station can have a height of 2 m to 4 m. For example, the cooling station can have a throughput of 5 to 30 wafer sheets per minute.

[0058] If applicable, two cooling stations or more cooling stations can be arranged one after the other, such that the wafer sheets pass through such cooling stations one after the other. If applicable, several cooling stations according to the invention can be arranged in a row.

[0059] If applicable, a conventional cooling station can be added downstream of a cooling station according to the invention. For example, freshly-formed, soft wafer blocks can be gently cooled in the cooling station according to the invention without being turned in the first deflecting section. However, if the wafer blocks have been cooled down to a certain temperature in the cooling station according to the invention, they can be further cooled in a conventional cooling station, if applicable.

[0060] The wafer sheets are preferably flat-wafer or hollow-wafer sheets baked under pressure from a liquid baking mass containing at least 40% water in the unbaked state. The wafer sheets preferably have dimensions in the range of approximately 40 cm x 80 cm. For example, the core thickness of the wafer sheets is approximately 1 -3 mm. The wafer sheets have a porous, crispy-brittle consistency.

[0061 ] For example, the creme is a fatty edible creme, such as a hazelnut creme or a chocolate creme. [0062] In the following, the invention is further described with reference to the figures and to exemplary embodiments.

[0063] Fig. 1 shows a schematic, reduced-height side view or sectional view of components of a cooling station.

[0064] Fig. 2 shows a lower region of a wafer sheet conveyor.

[0065] Figs. 3a through 3c show components of the cooling station in the region of the displacement device.

[0066] Unless stated otherwise, the reference signs correspond to the following components: creme 1 , wafer sheet 2, cooling region 3, wafer sheet conveyor 4, transfer region 5, pickup region 6, first conveying section 7, second conveying section 8, first deflecting section 9, second deflecting section 10, displacement device 11 , end region (of first conveying section) 12, start region (of second conveying section) 13, tray 14, holding device 15, conveying device 16, housing 17, tray section 18, guide device 19, conveying member 20, support extension 21 , holding mechanism 22.

[0067] Fig. 1 shows a cooling station with a wafer sheet conveyor 4, which is formed in particular as an endless conveyor or vertical conveyor. The wafer sheet conveyor 4 is suitable and/or configured for conveying wafer sheets 2, which may be provided with a creme 1 on their upper side, along a cooling region 3, in order to effect cooling. The wafer sheet conveyor 4 comprises a first conveying section 7, in which the wafer sheets 2 are conveyed upwards. In addition, the wafer sheet conveyor 4 comprises a second conveying section

8, in which the wafer sheets 2 are conveyed downwards. Deflecting sections

9, 10 are provided between the two conveying sections 7, 8 - in particular, a first deflecting section 9, in which the wafer sheet conveyor 4 is deflected from the first conveying section 7 to the second conveying section 8, and a second deflecting section 10, in which the wafer sheet conveyor 4 is deflected from the second conveying section 8 to the first conveying section 7. In the region of the deflecting sections 9, 10, the wafer sheet conveyor 4 is deflected by 180° in the present embodiment. In order to avoid the wafer sheets 2 thereby also being turned - in particular, if they are provided with a creme 1 - a displacement device 11 is provided. The displacement device 11 is suitable and/or configured for displacing wafer sheets 2 from one conveying section to the other in such a manner that the creme 1 is always arranged on the upper side of the wafer sheet 2. In particular, the wafer sheets 2 lie on trays 14 upon being displaced. Alternatively, the design can be operated in reverse, such that the wafer sheets 2 are conveyed downwards in the first conveying section 7 and upwards in the second conveying section 8.

[0068] In the present embodiment, the displacement device 11 displaces the wafer sheets 2 from the first conveying section 7 to the second conveying section 8. This takes place upstream of the first deflecting section 9. In particular, the displacement device 11 is arranged in the end region 12 of the first conveying section 7 and in the start region 13 of the second conveying section 8. The wafer sheets 2 are preferably conveyed upwards as far as possible along the first conveying section 7 and then, before being inclined in the first deflecting section 9, are displaced to the second conveying section 8. Such displacement preferably takes place transversely to the course of the wafer sheet conveyor 4 in the conveying sections 7, 8. In particular, the displacement takes place horizontally and/or along the main extension direction of the wafer sheets 2. Subsequently, the wafer sheets 2 with their creme 1 still arranged on the upper side are conveyed further and in particular down along the second conveying section 8 of the wafer sheet conveyor 4. During this conveyance through the cooling region 3, the wafer sheets 2 and in particular the creme 1 arranged thereon are cooled. For this purpose, a cooling device such as a fan or a cooling unit can be provided in all embodiments. The cooling region 3 is preferably arranged in a housing 17, on which or in which the cooling device acts. The housing 17 has the necessary openings to feed and discharge the wafer sheets 2. For example, the cooling air is introduced into the housing 17 laterally, i.e. , parallel to the deflection axis of the wafer sheet conveyor 4. Preferably, a dehumidifier is provided to remove moisture generated during cooling from the housing 17. Preferably, the cooling air is introduced in a lower region of the housing 17 and extracted in an upper region.

[0069] The displacement device 11 preferably comprises a drive - in particular, a linear drive. In all embodiments, this drive can be formed, for example, as a servo-linear axis with a recirculating ball screw or a rack-and-pinion axis.

[0070] Preferably, in all embodiments, the drive for the displacement device 11 is formed at the top and is arranged within the housing 17 of the cooling station. By actuating the drive, the displacement device 11 is actuated, and the wafer sheets 2 are displaced from one conveying section to the other conveying section.

[0071 ] Preferably, in all embodiments, the drive of the displacement device 11 is arranged in the first deflecting section 9. In particular, this drive is provided between the holding devices 15 in the first deflecting section 9. In this region, there is a free space for the drive, since the trays 14 or the wafer sheets 2 are displaced in a region further down - in particular, in the end region of the first conveying section - and thus do not enter the first deflecting section 9. The wafer sheet conveyor 4 - in particular, the holding devices 15 in the first deflecting section 9 - thus project upwards beyond the drive of the displacement device 11 and the displacement device 11 as such in the first deflecting section 9. This configuration enables a reduction in the height of the cooling station.

[0072] In all embodiments, the displacement device 11 can comprise one or more support extensions 21. Such support extensions 21 serve to center the outer ends of the trays 14 in their position in such a manner as to facilitate the displacement of the trays 14 or the wafer sheets 2. In particular, due to a clearance-related mounting of the trays 14 in the holding devices 15, the outer ends of the trays 14 may be inclined downwards to a certain extent. The support extensions 21 of the displacement device 11 engage the trays 14 during displacement and lift the rear edges of the trays 14, such that the trays 14 are aligned and displaced in a predetermined position.

[0073] As in the present embodiment, the support extensions 21 may have rollers, which are mounted on ball bearings for example, and which allow the trays 14 or the wafer sheets 2 to be lifted and moved particularly gently.

[0074] The wafer sheets 2 are fed by a conveying device 16. The wafer sheets 2 can also be transported away by a conveying device 16. The conveying devices 16 may be formed as belt conveyors, for example.

[0075] Preferably, the wafer sheets 2 are transported on trays 14. Such trays 14 are preferably plate-shaped or grid-shaped bodies, which are attached or releasably attached to the wafer sheet conveyor 4. In the present embodiment, the wafer sheet conveyor 4 comprises several holding devices 15. The holding devices 15 enable the holding of the trays 14 on the wafer sheet conveyor 4. In particular, the trays 14 are held on the wafer sheet conveyor 4 in such a manner that they are moved along the first conveying section 7 and the second conveying section 8 with the wafer sheet conveyor 4. Moreover, the holding devices 15 are configured in such a manner that the trays 14 can be moved with respect to the wafer sheet conveyor 4 at least in the region of the displacement device 11 , and that the displacement device 11 can displace the trays 14 from one conveying section to the other - in particular, from the first conveying section 7 to the second conveying section 8. Preferably, the holding devices 15 are formed to be groove-shaped or rail-shaped. As a result, the trays 14 are held in a form-fitting manner on the wafer sheet conveyor 4 in one direction - in particular, the direction along the vertical axis. Transversely to this, i.e. , along the groove or the rail, a displacement of the trays 14 can take place.

[0076] If applicable, it is provided that the trays 14 not be displaced by a displacement device 11 during the transition from the second conveying section back to the first conveying section, i.e., in the second deflecting section 10, but that the trays 14 be simply deflected and pivoted by 180° in such region.

[0077] If the trays 14 are pivoted in the second deflecting section 10 and are not displaced in parallel, they may be used in particular to remove the wafer sheets 2 from a conveying device during the pivoting movement.

[0078] In order to prevent the trays 14 from falling out of the holding devices 15 in the second deflecting section 10, a holding mechanism 22 can be provided. For example, the trays 14 may be provided in the center with a projecting lug, which prevents the trays 14 from falling out of the holding devices 15. The lugs of the trays 14 are preferably arranged in such a manner that the displacement of the trays 14 by the displacement device 11 is nevertheless possible. For example, the lugs of the trays 14 may be formed such that the trays 14 may be moved from one conveying section to another, but the pulling of the trays 14 outwards is prevented.

[0079] For holding the trays 14 or as a stop for the lugs, the holding devices 15 can each also have a lug or hook at their ends or in another region, which enables a form-fitting holding of the lugs of the trays 14, such that the trays 14 cannot be pulled outwards from the holding devices 15.

[0080] The holding mechanism 22 is preferably formed to be releasable, and in particular releasable without tools. This allows the trays 14 to be easily removed through doors of the cooling station. [0081 ] For example, the lug is formed to be spring-loaded. By pushing in the lug, the holding mechanism 22 can be released, and the tray 14 can be removed.

[0082] If applicable, in all embodiments, it is provided that the holding devices

15 and the trays be formed of materials, or have a surface, which promotes or facilitates the displacement of the trays 14. For example, a tribological pairing can be selected for the two components, tray 14 and holding device 15. For example, a tribological pairing of hard-coated aluminum and stainless steel can be selected.

[0083] Alternatively, a metal part with a tribological layer made of plastic, e.g., of POM, can be used. For example, the holding devices 15 each have a base body made of stainless steel, which is provided with a POM tribological layer. The trays 14 may be formed of stainless steel, for example.

[0084] In principle, any other suitable tribological pairing is possible, wherein particular attention must be paid to suitability for the transport of foodstuffs.

[0085] The wafer sheets 2 are fed to the wafer sheet conveyor 4 in a transfer region 5. The cooled wafer sheets 2 from the wafer sheet conveyor 4 are transported away in a pickup region 6.

[0086] For the damage-free transfer of wafer sheets 2 to the wafer sheet conveyor 4, trays 14 may comprise finger-shaped tray sections 18. Such finger-shaped tray sections 18 allow the wafer sheets 2 to be picked up from below and transported onwards. In particular, the finger-shaped tray sections 18 also allow the wafer sheets 2 to be deposited back onto a conveying device

16 in the pickup region 6.

[0087] Fig. 2 shows the finger-shaped tray sections 18 of the trays 14. In particular, the end region, or the end region turned towards the wafer sheet conveyor 4, of the conveying devices 16 can also have finger-shaped projections. If applicable, the belts of a belt conveyor can be deflected without axes or shafts, in order to convey wafer sheets 2 to the wafer sheet conveyor 4. Subsequently, the finger-shaped tray sections 18 engage in a comb-like manner between the belts of the conveying device 16, in order to remove the wafer sheets 2 in the transfer region 5 from the conveying device 16, which is not shown. In the pickup region 6, in which the wafer sheets 2 are picked up from the wafer sheet conveyor 4, the finger-shaped tray sections 18 move through the extensions of the conveying device 16, which is not shown, in order to deposit the wafer sheets 2 in the pickup region 6 on the conveying device 16.

[0088] Preferably, it is provided that the trays 14 have a central middle region, from which finger-shaped tray sections 18 project in both directions. The one side of the finger-shaped tray sections 18 is suitable and/or configured for removing the wafer sheets 2 from the conveying device 16 on one side of the wafer sheet conveyor 4. The other side of the finger-shaped tray sections 18 is suitable and/or configured for depositing the wafer sheets 2 in the pickup region 6 on the conveying device 16 arranged on the other side. The trays 14 are displaced by the displacement device 11 from one conveying section to the other conveying section, whereby one side of the tray 14 faces outwards at one time, and the other side of the tray 14 faces in the other conveying section. For this reason, it is advantageous if finger-shaped tray sections 18 are provided on both sides.

[0089] Figs. 3a through 3c show components of the cooling station in the region of the displacement device 11 in different positions. The wafer sheets 2 are conveyed upwards along the first conveying section 7. Once a wafer sheet 2 has arrived at the end region 12 of the first conveying section 7, the wafer sheet conveyor 4 is stopped, as shown in Fig. 3a. Subsequently, the displacement device 11 is actuated in order to displace the wafer sheets 2 to the second conveying section 8, as shown in Fig. 3b. In particular, the displacement device 11 displaces the wafer sheets 2 from the end region 12 of the first conveying section 7 to the start region 13 of the second conveying section 8, as shown in Fig. 3c.

[0090] It is preferably provided in all of the embodiments that the wafer sheets 2 be transported in a lying position on trays 14. In the present embodiment, the displacement device 11 acts on the trays 14. In particular, the displacement device 11 displaces the trays 14, and thereby also the wafer sheets 2 lying on the trays 14. When the wafer sheet conveyor 4 is stopped - in particular, during the displacement operation by the displacement device 11 - the holding devices 15 of the wafer sheet conveyor 4 are aligned with one another in such a manner that a tray 14 can be displaced from a holding device 15 in the first conveying section 7 to another holding device 15 of the second conveying section 8. Preferably, in all embodiments, it is provided that several wafer sheets 2 and thus, if applicable, several trays 14 be displaced simultaneously during one displacement operation. In this embodiment, three trays 14 are moved simultaneously.

[0091 ] Once the displacement operation is complete, the displacement device 11 can retract again. Subsequently, the wafer sheet conveyor 4 is moved further until, in turn, a wafer sheet 2 is arranged in the end region 12 of the first conveying section 7. At the same time, this also moves the wafer sheet conveyor 4 to the second conveying section 8, and the wafer sheets 2 arranged on it are removed from the region of the displacement device 11. Subsequently, the displacement device 11 can become active again, to convey wafer sheets 2 from the first conveying section 7 to the second conveying section 8.

[0092] A guide device 19 is preferably provided for guiding the trays 14 when displacing them from the first conveying section 7 to the second conveying section 8. This guide device 19 is preferably arranged between the first conveying section 7 and the second conveying section 8, and guides the trays 14 and/or the wafer sheets 2.

[0093] If applicable, the guide device 19 can comprise grooves, in which the trays 14 are guided. For example, as shown in Figs. 1 and 3, the grooves can be formed to converge conically along the direction of displacement, in order to insert the trays 14 into the holding devices 15 of the second conveying section 8 in a targeted manner. In all embodiments, guide devices 19 may alternatively be formed by rollers or roller bearings, arranged in a row, which guide the trays. In particular, the trays may be guided by rotatably-mounted rollers along their direction of displacement.

[0094] The guide device 19 can, for example, be formed in such a manner that they guide the trays 14, which are displaced from one conveying section 7 to the other conveying section 8, laterally along the direction of displacement. The trays 14 are guided in their edge region in such a manner that sufficient space is kept free to transport or displace the wafer sheets 2 lying on the trays 14 without damage. In particular, the guide device 19 is configured for supporting the trays 14 during displacement, such that, apart from the holding devices 15, they are also guided at a further point. In addition, the guide device 19 is formed to align the trays 14 during displacement, such that they can be inserted precisely into the holding device 15 of the other or second conveying section 8.

[0095] Preferably, the guide device 19 is formed by several elements arranged, for example, on both sides of the trays 14. Preferably, such elements each have inlet bevels or inlet roundings, which allow the trays 14 to be inserted into the guide device 19, even if tolerances prevent the trays 14 from being guided precisely in the holding devices 15. [0096] As noted, the guide and the inlet bevels may be formed, for example, by grooves that are formed to converge conically along the direction of displacement of the trays 14 or have at least one converging section.

[0097] Alternatively or additionally, the guide can be formed by rollers or roller bearings arranged in a row. Due to the cylindrical or wheel-shaped design, the rollers form inlet roundings. Rotatably-arranged rollers can be used to center or precisely guide the trays 14, while keeping the friction during guidance as low as possible.

[0098] For example, four rollers may be provided on both sides to guide a tray 14. The rollers may each be arranged in pairs, such that, between a pair of rollers, a gap is kept free in which the tray 14 is guided. Due to the fact that two pairs of rollers are arranged along the displacement path in each case, the direction of guidance of the trays 14 in the guide device 19 can also be precisely defined. If, with such design, the trays 14 are guided on both sides, eight rollers are provided per tray 14.

[0099] Alternatively, however, a guide can be provided by three rollers per side, wherein two guide rollers are provided on each side, and a pressure roller arranged on the other side of the tray 14 is provided, such that a precise guide of a tray 14 can also be formed. For example, the two guide rollers may be arranged below the tray 14, and the pressure roller may be arranged above the tray 14.

[0100] In all embodiments, it is preferably provided that the guide device 19 guide the trays 14, during the displacement from one conveying section 7 to the other conveying section 8, in the middle region - in particular, between the two conveying sections 7, 8 - such that the trays 14 are inserted with pinpoint accuracy from one holding device 15 into the holding device 15 of the other conveying section 7. [0101 ] Moreover, in all embodiments, the holding devices 15 may preferably have inlet bevels in order to allow easier insertion of the trays 14.

[0102] Preferably, the wafer sheet conveyor 4 comprises at least one endless conveying member 20 - for example, a conveyor belt or a conveyor chain. The holding devices 15 may be attached to such conveying member 20. The conveying member 20 is preferably an endless conveying member, which, if applicable, extends in a straight line through the first conveying section 7 and the second conveying section 8, and is deflected by 180° in the deflecting sections 9, 10. This deflection of the conveying member 20 also turns the holding devices 15 by 180°. In the present embodiment, two conveying members 20 are provided, which are arranged on both sides of the wafer sheets 2 or on both sides of the trays 14. Both conveying members 20 are provided with several holding devices 15, such that the holding devices 15 hold the trays 14 on both sides. The two conveying members 20 may, for example, be driven by one drive. If applicable, two synchronized drives are provided, or one drive is provided, wherein its motion is transmitted to both conveying members 20 via a shaft.