COOLING STRUCTURE AND ELECTRONIC DEVICE USING SAME

WIPO Patent Application WO/2013/111561

A1

[Problem] When a cooling structure that is based on an ebullient cooling system is mounted in a thin electronic device, adequate cooling performance cannot be obtained. [Solution] This cooling structure has: an evaporation unit that is thermally connected to a heat-generating body and stores a refrigerant; a condensation unit that condenses the gas-phase refrigerant that has been vaporized by the evaporation unit; and piping that connects the evaporation unit and the condensation unit. The condensation unit includes a horizontally extended flat container, and there are connection ports on the side of the condensation unit for connecting to the piping. In addition, the condensation unit is equipped with a partition plate that divides the interior of the condensation unit into an upper space, located higher in the vertical direction, and a lower space, located lower in the vertical direction. The partition plate has an aperture part that connects the upper space and the lower space.

MATSUNAGA ARIHIRO (JP)
YOSHIKAWA MINORU (JP)
SAKAMOTO HITOSHI (JP)
SHOUJIGUCHI AKIRA (JP)
CHIBA MASAKI (JP)
INABA KENICHI (JP)

PCT/JP2013/000266

August 01, 2013

January 22, 2013

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NEC CORP (JP)
MATSUNAGA ARIHIRO (JP)
YOSHIKAWA MINORU (JP)
SAKAMOTO HITOSHI (JP)
SHOUJIGUCHI AKIRA (JP)
CHIBA MASAKI (JP)
INABA KENICHI (JP)

F28D15/02; H01L23/427; H05K7/20

JP2008249314A	2008-10-16
JP2009147156A	2009-07-02
JP2010079406A	2010-04-08
JP2010079404A	2010-04-08
JP2005077018A	2005-03-24
JP2001356842A	2001-12-26

SHIMOSAKA, NAOKI (JP)
Naoki Shimosaka (JP)

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