Title:
COOLING STRUCTURE, COOLING STRUCTURE MANUFACTURING METHOD, POWER AMPLIFIER, AND TRANSMITTER
Document Type and Number:
WIPO Patent Application WO/2018/235726
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a cooling structure with which the level of freedom in the shape of a cooling water flow passageway can be increased without an increase in the size of the cooling structure, and with which cooling performance of the cooling structure can be exploited. For this purpose, a cooling structure according to the present invention is provided with: a base material formed with a cooling water flow passageway; a pipe which includes a first layer formed on an outer surface of the base material, and a second layer formed on the outside of the first layer; and a plate having the pipe cast therein. The base material is configured from a highly thermally conductive first material. The first layer is configured from a heat-resistant second material. The second layer is configured from a third material having high affinity with the second material. The plate is configured from a highly thermally conductive fourth material. The second material and the third material respectively have high affinity with the fourth material.
Inventors:
NAKAGAWA TAKAHIRO (JP)
Application Number:
PCT/JP2018/022822
Publication Date:
December 27, 2018
Filing Date:
June 15, 2018
Export Citation:
Assignee:
NEC CORP (JP)
International Classes:
H01L23/473; H05K7/20
Foreign References:
| JP2000340728A | 2000-12-08 | |||
| JP2016035945A | 2016-03-17 | |||
| US20070017658A1 | 2007-01-25 | |||
| JP2004214503A | 2004-07-29 | |||
| JPS5930465A | 1984-02-18 | |||
| JPH06304739A | 1994-11-01 | |||
| JPH04197569A | 1992-07-17 | |||
| JP2006066669A | 2006-03-09 | |||
| JP2017119258A | 2017-07-06 |
Other References:
See also references of EP 3644356A4
Attorney, Agent or Firm:
SHIMOSAKA Naoki (JP)
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