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Patent Searching and Data


Title:
COOLING STRUCTURE, POWER AMPLIFIER, AND TRANSMITTER
Document Type and Number:
WIPO Patent Application WO/2019/172233
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a cooling structure with which it is possible to maintain an appropriate positional relationship between a cooling pipe and a heat-generating body and to provide sufficient cooling even when the size of the heat-generating body is similar to or smaller than the cooling pipe; a power amplifier; and a transmitter. Accordingly, the cooling structure of the present invention is provided with: a cooling pipe which includes a base material having formed a refrigerant flow passageway, and a first layer formed on an outer surface of the base material; and a cold plate with the cooling pipe cast therein. The cooling pipe is arranged at a position such that, when viewed from a heat-generating body arranged on the cold plate, the outline of the cooling pipe is present within 45 degrees from the outside of the heat-generating body.

Inventors:
NAKAGAWA TAKAHIRO (JP)
Application Number:
JP2019/008573
Publication Date:
September 12, 2019
Filing Date:
March 05, 2019
Export Citation:
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Assignee:
NEC CORP (JP)
International Classes:
H01L23/473; H01L25/07; H01L25/18; H03F3/24; H05K7/20
Domestic Patent References:
WO2018235726A12018-12-27
Foreign References:
JP2016035945A2016-03-17
JP2001168569A2001-06-22
JP2017211837A2017-11-30
JP2003121039A2003-04-23
JP2003130517A2003-05-08
JP2005229033A2005-08-25
JP2008227434A2008-09-25
JPH04197569A1992-07-17
JPH0630473A1994-02-04
JP2018041922A2018-03-15
Attorney, Agent or Firm:
SHIMOSAKA Naoki (JP)
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