Title:
COOLING STRUCTURE, POWER AMPLIFIER, AND TRANSMITTER
Document Type and Number:
WIPO Patent Application WO/2019/172233
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a cooling structure with which it is possible to maintain an appropriate positional relationship between a cooling pipe and a heat-generating body and to provide sufficient cooling even when the size of the heat-generating body is similar to or smaller than the cooling pipe; a power amplifier; and a transmitter. Accordingly, the cooling structure of the present invention is provided with: a cooling pipe which includes a base material having formed a refrigerant flow passageway, and a first layer formed on an outer surface of the base material; and a cold plate with the cooling pipe cast therein. The cooling pipe is arranged at a position such that, when viewed from a heat-generating body arranged on the cold plate, the outline of the cooling pipe is present within 45 degrees from the outside of the heat-generating body.
Inventors:
NAKAGAWA TAKAHIRO (JP)
Application Number:
PCT/JP2019/008573
Publication Date:
September 12, 2019
Filing Date:
March 05, 2019
Export Citation:
Assignee:
NEC CORP (JP)
International Classes:
H01L23/473; H01L25/07; H01L25/18; H03F3/24; H05K7/20
Domestic Patent References:
WO2018235726A1 | 2018-12-27 |
Foreign References:
JP2016035945A | 2016-03-17 | |||
JP2001168569A | 2001-06-22 | |||
JP2017211837A | 2017-11-30 | |||
JP2003121039A | 2003-04-23 | |||
JP2003130517A | 2003-05-08 | |||
JP2005229033A | 2005-08-25 | |||
JP2008227434A | 2008-09-25 | |||
JPH04197569A | 1992-07-17 | |||
JPH0630473A | 1994-02-04 | |||
JP2018041922A | 2018-03-15 |
Other References:
See also references of EP 3764396A4
Attorney, Agent or Firm:
SHIMOSAKA Naoki (JP)
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