Title:
COOLING STRUCTURE, AND POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/125548
Kind Code:
A1
Abstract:
The present invention is provided with: a semiconductor power module (11) having, formed on one surface thereof, a heat dissipation member (13); and a cooling body (3) which is joined to the heat dissipation member. The cooling body is provided with a cooling-fluid passage (5) which is formed so as to be open at a side joined to the heat dissipation body, and through which a cooling fluid flows. In the heat dissipation member, protruded fluid-contact parts (17), which are disposed so as to be inserted into the cooling-fluid passage at a side joined to the cooling body, are formed. A fluid-tight seal member (7) is disposed between the cooling body and the heat dissipation member. The fluid-tight seal member is provided with: a seal part (7b) which is firmly adhered between the cooling body and the heat dissipation member; and a positioning part (7d) which engages with an outside surface of the heat dissipation member to position the seal part. Furthermore, sealed surfaces (6, 13a) of the cooling body and the heat dissipation member, said sealed surfaces having the seal part firmly adhered thereto, are formed as flat surfaces.
Inventors:
TANAKA YASUHITO (JP)
Application Number:
PCT/JP2013/007591
Publication Date:
August 21, 2014
Filing Date:
December 25, 2013
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L23/473; H01L25/07; H01L25/18; H02M7/48; H05K7/20
Domestic Patent References:
| WO2012056880A1 | 2012-05-03 |
Foreign References:
| JP2008311550A | 2008-12-25 | |||
| JP2003049948A | 2003-02-21 | |||
| JPH0666373A | 1994-03-08 | |||
| JPH112332A | 1999-01-06 | |||
| JP2012210000A | 2012-10-25 |
Attorney, Agent or Firm:
HIROSE, Hajime et al. (JP)
Hirose 1 (JP)
Hirose 1 (JP)
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