Title:
COOLING SYSTEM, COOLER, AND COOLING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/150415
Kind Code:
A1
Abstract:
Provided is a cooling system able to cool efficiently, without requiring a drive source for a refrigerant, even for a plurality of densely-mounted electronic components having a high level of generated heat. This cooling system (1) comprises: a heat-receiving section (11) having a substantially constant cross-sectional area along a longitudinal direction in which the length of a cooling region (10) where heat sources are cooled, such length following the disposition of the heat sources, is the greatest; a supply tube (12) for supplying refrigerant in a liquid state to inside the heat-receiving section; a recovery tube (13) for recovering the refrigerant, which is vaporized when receiving the heat, from inside the heat-receiving section; and a heat radiation section (14) for cooling the recovered refrigerant and supplying same in a liquid state to the supply tube. The heat-receiving section has a refrigerant pathway (15) for causing the refrigerant supplied from the supply tube to flow out into the heat-receiving section along the longitudinal direction.
Inventors:
CHIBA MASAKI (JP)
HACHIYA MAHIRO (JP)
HACHIYA MAHIRO (JP)
Application Number:
PCT/JP2017/007363
Publication Date:
September 08, 2017
Filing Date:
February 27, 2017
Export Citation:
Assignee:
NEC CORP (JP)
International Classes:
F28D15/02; H01L23/427; H05K7/20
Domestic Patent References:
| WO2014069174A1 | 2014-05-08 | |||
| WO2016059799A1 | 2016-04-21 |
Foreign References:
| JP2014029232A | 2014-02-13 | |||
| JP2003161547A | 2003-06-06 | |||
| US20150305199A1 | 2015-10-22 |
Attorney, Agent or Firm:
SHIMOSAKA Naoki (JP)
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