Title:
COOLING SYSTEM, COOLING DEVICE, AND ELECTRONIC SYSTEM
Document Type and Number:
WIPO Patent Application WO/2018/186095
Kind Code:
A1
Abstract:
[Problem] To provide a cooling system, a cooling device, and an electronic system which can reduce the amount of inert refrigerant to be used and equipment cost. [Solution] A cooling system 10 includes a cooling device 26, and a pump 21 and a heat release device 30 which are connected to the cooling device 26. The cooling device 26 includes: first and second refrigerant tanks 12 each storing a first refrigerant 19 that is output from the heat release device 30 and is input to the heat release device 30; and an immersion tank 13 capable of holding an electronic device 27 in a second refrigerant 16 that is output from the pump 21 and is input to the pump 21, the immersion tank being sandwiched between the first and second refrigerant tanks 12.
Inventors:
INANO SATOSHI (JP)
FUKUDA HIROYUKI (JP)
ISHINABE MINORU (JP)
WAKINO YUKIKO (JP)
FUKUDA HIROYUKI (JP)
ISHINABE MINORU (JP)
WAKINO YUKIKO (JP)
Application Number:
PCT/JP2018/008624
Publication Date:
October 11, 2018
Filing Date:
March 06, 2018
Export Citation:
Assignee:
FUJITSU LTD (JP)
International Classes:
G06F1/20; F28D7/00; H05K7/20
Domestic Patent References:
WO2014083810A1 | 2014-06-05 |
Foreign References:
JPH05243771A | 1993-09-21 | |||
JPH02214147A | 1990-08-27 | |||
JPH02148891A | 1990-06-07 | |||
JP2008025858A | 2008-02-07 | |||
US4694378A | 1987-09-15 |
Attorney, Agent or Firm:
MUKOUYAMA, Naoki (JP)
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