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Title:
COOLING SYSTEM FOR ELECTRONIC DEVICES
Document Type and Number:
WIPO Patent Application WO/2019/229491
Kind Code:
A1
Abstract:
Here the cooling system includes a thermosiphon system that includes a condenser, an evaporator, a regulator coupled with the evaporator and a conduit between the evaporator and the condenser. The thermosiphon system is thermally coupled to the electronic device mounted on the rack such that heat generated by the device is transferred to the working fluid in the evaporator, vaporising the working fluid. The vaporised working fluid is then transferred to the condenser through the conduit, where it releases the transferred heat and condenses to liquid, available for further reuse by the evaporator to maintain a certain level of the working fluid. Also there is a regulator coupled with the evaporator to maintain a fixed level of the working fluid based on the power supply for the rack mounted electronic device to which the thermosiphon system is thermally coupled.

Inventors:
SHARMA PRATIK (IN)
Application Number:
PCT/IB2018/053762
Publication Date:
December 05, 2019
Filing Date:
May 26, 2018
Export Citation:
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Assignee:
SHARMA PRATIK (IN)
International Classes:
F28D15/00; H01L23/427; H01L23/473
Domestic Patent References:
WO2017127059A12017-07-27
Foreign References:
US5966957A1999-10-19
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Claims:
Claims

Following is the claim for this invention: -

1 . In this invention we provide a cooling system for rack mounted electronic devices.

The cooling system includes a thermosiphon system that includes a condenser, an evaporator, a regulator coupled with the evaporator and a conduit between the evaporator and the condenser. The thermosiphon system is thermally coupled to the electronic device mounted on the rack such that heat generated by the device is transferred to the working fluid in the evaporator, vaporising the working fluid. The vaporised working fluid is then transferred to the condenser through the conduit, where it releases the transferred heat and condenses to liquid, available for further reuse by the evaporator to maintain a certain level of the working fluid. Also there is a regulator coupled with the evaporator to maintain a fixed level of the working fluid based on the power supply for the rack mounted electronic device to which the thermosiphon system is thermally coupled. The above novel technique by which we provide a cooling system for rack mounted electronic devices is the claim for this invention.

Description:
Cooling System For Rack Mounted Electronic Devices

In this invention we provide a cooling system for rack mounted electronic devices. The cooling system includes a thermosiphon system that includes a condenser, an evaporator, a regulator coupled with the evaporator and a conduit between the evaporator and the condenser. The thermosiphon system is thermally coupled to the electronic device mounted on the rack such that heat generated by the device is transferred to the working fluid in the evaporator, vaporising the working fluid. The vaporised working fluid is then transferred to the condenser through the conduit, where it releases the transferred heat and condenses to liquid, available for further reuse by the evaporator to maintain a certain level of the working fluid. Also there is a regulator coupled with the evaporator to maintain a fixed level of the working fluid based on the power supply for the rack mounted electronic device to which the thermosiphon system is thermally coupled.