Title:
COOLING SYSTEM AND HEAT ABSORBING DEVICE
Document Type and Number:
WIPO Patent Application WO/2002/046677
Kind Code:
A1
Abstract:
A cooling system and heat absorbing device, the cooling system feeding liquid refrigerant from a pump to a heat absorbing device, the heat absorbing device introducing the fed liquid refrigerant from a high-pressure chamber (48) to an evaporating chamber (49), wherein the liquid refrigerant passes through a nozzle (53), atomized refrigerant, i.e., fine droplets of liquid refrigerant are sprayed from the nozzle into the evaporation chamber (49), the fine droplets form uniform thin liquid films on the surfaces of fins (51), heat transferred from a heating element, i.e., a CPU (33) to the fins (51) evaporates the refrigerant on the surfaces of the fins (51), namely, the refrigerant evaporates and, in such a vaporization, the refrigerant removes a large amount of heat from the fins (51), whereby the CPU (33) is cooled efficiently.
Inventors:
NORI HITOSHI (JP)
WEI JIE (JP)
WEI JIE (JP)
Application Number:
PCT/JP2000/008571
Publication Date:
June 13, 2002
Filing Date:
December 04, 2000
Export Citation:
Assignee:
FUJITSU LTD (JP)
NORI HITOSHI (JP)
WEI JIE (JP)
NORI HITOSHI (JP)
WEI JIE (JP)
International Classes:
H01L23/427; (IPC1-7): F28D15/02; H01L23/427
Foreign References:
| JPH0461259A | 1992-02-27 | |||
| US5349831A | 1994-09-27 | |||
| JPH10288481A | 1998-10-27 | |||
| JPS61223469A | 1986-10-04 |
Attorney, Agent or Firm:
Yamazaki, Kaoru (Suite 403 6-13 Kudan-minami 4-chome Chiyoda-ku, Tokyo, JP)
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