Title:
COOLING SYSTEM AND COOLING METHOD FOR ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2016/075838
Kind Code:
A1
Abstract:
Provided are a cooling system and a cooling method that are simple and efficient, and improved in performance for cooling an electronic apparatus. The cooling system 10 has a cooling tank 12, and the open space of the cooling tank 12 has thereinside a second cooling liquid 13 having a boiling point T2. In the open space of the cooling tank 12, an electronic apparatus 100 in which a processor 110, which is a heat emitting element, is mounted on a board 120 is housed and immersed in the second cooling liquid 13. An ebullient cooling device 200 is thermally connected to the processor 110, and has a first cooling liquid 11 having a boiling point T1 (T2 > T1) encapsulated therein.
Inventors:
SAITO MOTOAKI (JP)
Application Number:
PCT/JP2014/080278
Publication Date:
May 19, 2016
Filing Date:
November 14, 2014
Export Citation:
Assignee:
EXASCALER INC (JP)
International Classes:
H01L23/427; F25D9/00; F28D15/02; G06F1/20; H05K7/20
Foreign References:
| JPS6154654A | 1986-03-18 | |||
| JP2013007501A | 2013-01-10 | |||
| JPH04226057A | 1992-08-14 | |||
| JPH04372159A | 1992-12-25 | |||
| JPH02214147A | 1990-08-27 | |||
| JPH0363993U | 1991-06-21 | |||
| US20100118494A1 | 2010-05-13 | |||
| US5720338A | 1998-02-24 |
Other References:
"Shinshiekirei wa HPC/Supakon no Mirai o Sukuu noka? - ExaScaler ga Hoshusei ni Sugureta Kanzen Kaihogata no Ekishin Reikyaku System o Kaihatsu", 22 October 2014 (2014-10-22), Retrieved from the Internet [retrieved on 20141126]
"Kanzen Kaihogata de Hoshusei ni Sugure, System Zentai o Kokoritsu ni Reikyaku suru Shin Ekishin Reikyaku Shuho o Kaihatsu (16kW Made no Reikyaku ga Kano na 8U Ekishin Reikyaku System 'ESLC-8' o, SC14 de Panel Tenji", 14 October 2014 (2014-10-14), Retrieved from the Internet [retrieved on 20141126]
TUMA, P.E.: "The Merits of Open Bath Immersion Cooling of Datacom Equipment", 26TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM PROCEEDINGS 2010, 21 February 2010 (2010-02-21), pages 123 - 131
"Kanzen Kaihogata de Hoshusei ni Sugure, System Zentai o Kokoritsu ni Reikyaku suru Shin Ekishin Reikyaku Shuho o Kaihatsu (16kW Made no Reikyaku ga Kano na 8U Ekishin Reikyaku System 'ESLC-8' o, SC14 de Panel Tenji", 14 October 2014 (2014-10-14), Retrieved from the Internet
TUMA, P.E.: "The Merits of Open Bath Immersion Cooling of Datacom Equipment", 26TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM PROCEEDINGS 2010, 21 February 2010 (2010-02-21), pages 123 - 131
Attorney, Agent or Firm:
KURODA, Kenji et al. (JP)
Kenji Kuroda (JP)
Kenji Kuroda (JP)
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