Title:
TETRAFLUOROETHYLENE/HEXAFLUOROPROPYLENE COPOLYMER, AND ELECTRIC WIRE
Document Type and Number:
WIPO Patent Application WO/2015/119053
Kind Code:
A1
Abstract:
Provided is a tetrafluoroethylene/hexafluoropropylene copolymer in which lumps do not easily form during wire molding, and in which, even if lumps do form, large lumps do not easily form. The tetrafluoroethylene/hexafluoropropylene copolymer is characterized by having: a melt flow rate measured at 372°C of 35.0 to 45.0 g/10 minutes, swells of -8.0 to 5.0%, and a total of not more than 120 -CF2H groups and unstable terminal groups per 1×106 carbon atoms.
Inventors:
ISAKA TADAHARU
FUKAGAWA RYOUICHI
SHIMONO TAKESHI
SHIOTSUKI KEIZOU
FUKAGAWA RYOUICHI
SHIMONO TAKESHI
SHIOTSUKI KEIZOU
Application Number:
PCT/JP2015/052661
Publication Date:
August 13, 2015
Filing Date:
January 30, 2015
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
DAIKIN AMERICA INC (US)
DAIKIN AMERICA INC (US)
International Classes:
C08F214/26; C08F214/28; H01B7/02
Domestic Patent References:
| WO2006123694A1 | 2006-11-23 |
Foreign References:
| JP2011514407A | 2011-05-06 | |||
| JP2010539252A | 2010-12-16 |
Other References:
See also references of EP 3091042A4
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
Patent business corporation Yasutomi international patent firm (JP)
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