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Patent Searching and Data


Title:
COPOLYMERIZED POLYAMIDE RESIN, METHOD FOR PREPARING SAME, AND MOLDED PRODUCT COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2015/178560
Kind Code:
A1
Abstract:
A copolymerized polyamide resin of the present invention is characterized by comprising: a repeating unit induced from dicarboxylic acid; a repeating unit induced from diamine; and a repeating unit represented by chemical formula 1, wherein the melting point (Tm) of the copolymerized polyamide resin is about 280℃ to about 330℃. The copolymerized polyamide resin has excellent heat resistance and melt-processability.

Inventors:
IM SANG KYUN (KR)
BAE SHIN HYO (KR)
KOWN SO YOUNG (KR)
PARK TAE JOON (KR)
KIM JOON SUNG (KR)
KIM JIN KYU (KR)
JIN YOUNG SUB (KR)
Application Number:
PCT/KR2014/011779
Publication Date:
November 26, 2015
Filing Date:
December 03, 2014
Export Citation:
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Assignee:
SAMSUNG SDI CO LTD (KR)
International Classes:
C08G69/02; C08G69/04; C08G69/26; C08G69/48
Foreign References:
KR970005109B11997-04-12
KR20120040069A2012-04-26
KR20130073773A2013-07-03
KR20110032001A2011-03-29
KR970042683A1997-07-24
Other References:
See also references of EP 3147305A4
Attorney, Agent or Firm:
AJU KIM CHANG & LEE (KR)
특허법인아주양헌 (KR)
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