Title:
COPOLYMERIZED POLYAMIDE RESIN, METHOD FOR PREPARING SAME, AND MOLDED PRODUCT COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2015/178560
Kind Code:
A1
Abstract:
A copolymerized polyamide resin of the present invention is characterized by comprising: a repeating unit induced from dicarboxylic acid; a repeating unit induced from diamine; and a repeating unit represented by chemical formula 1, wherein the melting point (Tm) of the copolymerized polyamide resin is about 280℃ to about 330℃. The copolymerized polyamide resin has excellent heat resistance and melt-processability.
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Inventors:
IM SANG KYUN (KR)
BAE SHIN HYO (KR)
KOWN SO YOUNG (KR)
PARK TAE JOON (KR)
KIM JOON SUNG (KR)
KIM JIN KYU (KR)
JIN YOUNG SUB (KR)
BAE SHIN HYO (KR)
KOWN SO YOUNG (KR)
PARK TAE JOON (KR)
KIM JOON SUNG (KR)
KIM JIN KYU (KR)
JIN YOUNG SUB (KR)
Application Number:
PCT/KR2014/011779
Publication Date:
November 26, 2015
Filing Date:
December 03, 2014
Export Citation:
Assignee:
SAMSUNG SDI CO LTD (KR)
International Classes:
C08G69/02; C08G69/04; C08G69/26; C08G69/48
Foreign References:
KR970005109B1 | 1997-04-12 | |||
KR20120040069A | 2012-04-26 | |||
KR20130073773A | 2013-07-03 | |||
KR20110032001A | 2011-03-29 | |||
KR970042683A | 1997-07-24 |
Other References:
See also references of EP 3147305A4
Attorney, Agent or Firm:
AJU KIM CHANG & LEE (KR)
특허법인아주양헌 (KR)
특허법인아주양헌 (KR)
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