Title:
COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY SHEET/STRIP MATERIAL FOR ELECTRONIC/ELECTRIC DEVICE, COMPONENT FOR ELECTRONIC/ELECTRIC DEVICE, TERMINAL, AND BUSBAR
Document Type and Number:
WIPO Patent Application WO/2019/189558
Kind Code:
A1
Abstract:
This copper alloy for electronic/electric devices contains, by mass%, greater than or equal to 0.15% and less than 0.35% of Mg and greater than or equal to 0.0005% and less than 0.01% of P, the remainder consisting of Cu and unavoidable impurities, and satisfies (Mg)+20×(P) < 0.5, wherein, of the unavoidable impurities, the H content is less than or equal to 10 mass ppm, the O content is less than or equal to 100 mass ppm, the S content is less than or equal to 50 mass ppm and the C content is less than or equal to 10 mass ppm. The ratio NFJ3 of J3's, ofwhich all three grain boundaries of the grain boundary triple points are a special grain boundary, to all grain boundary triple points, and the ratio NFJ2 of J2's, of which two of the grain boundaries of the grain boundary triple point are special boundaries and one is a random grain boundary, to all grain boundary triple points, satisfy 0.20 < (NFJ2/(1-NFJ3) )0.5 ≤ 0.45.
Inventors:
MATSUNAGA HIROTAKA (JP)
KAWASAKI KENICHIRO (JP)
MORI HIROYUKI (JP)
MAKI KAZUNARI (JP)
AKISAKA YOSHITERU (JP)
KAWASAKI KENICHIRO (JP)
MORI HIROYUKI (JP)
MAKI KAZUNARI (JP)
AKISAKA YOSHITERU (JP)
Application Number:
PCT/JP2019/013552
Publication Date:
October 03, 2019
Filing Date:
March 28, 2019
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
MITSUBISHI SHINDO KK (JP)
MITSUBISHI SHINDO KK (JP)
International Classes:
C22C9/00; H01B1/02; H01B5/02; C22F1/00; C22F1/08
Domestic Patent References:
| WO2017170733A1 | 2017-10-05 | |||
| WO2017043559A1 | 2017-03-16 | |||
| WO2013150627A1 | 2013-10-10 |
Foreign References:
| JP2007056297A | 2007-03-08 | |||
| JP2017179553A | 2017-10-05 | |||
| JP2018069097A | 2018-05-10 | |||
| JP2007056297A | 2007-03-08 | |||
| JP2014114464A | 2014-06-26 |
Other References:
SEIICHI SUZUKI: "EBSD Reader: Using OIM", September 2009, TSL SOLUTIONS INC.
KRONBERG ET AL., TRANS. MET. SOC. AIME, vol. 185, 1949, pages 501
D. G. BRANDON, ACTA. METALLURGICA, vol. 14, 1966, pages 1479
See also references of EP 3778941A4
KRONBERG ET AL., TRANS. MET. SOC. AIME, vol. 185, 1949, pages 501
D. G. BRANDON, ACTA. METALLURGICA, vol. 14, 1966, pages 1479
See also references of EP 3778941A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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