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Title:
COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY PLASTIC WORKING MATERIAL FOR ELECTRONIC/ELECTRIC DEVICE, AND COMPONENT AND TERMINAL FOR ELECTRONIC/ELECTRIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/087624
Kind Code:
A1
Abstract:
This copper alloy for an electronic/electric device contains Mg in a range of 3.3-6.9 atomic%, with the remainder substantially being Cu and unavoidable impurities, and has a strength ratio (TSTD/TSLD) exceeding 1.02, with this strength ratio being calculated from the strength TSTD when a tension test is performed in a direction orthogonal to the rolling direction and the strength TSLD when a tension test is performed in the direction parallel to the rolling direction.

Inventors:
ITO YUKI (JP)
MAKI KAZUNARI (JP)
Application Number:
JP2014/078031
Publication Date:
June 18, 2015
Filing Date:
October 22, 2014
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/06; C22C9/10; C22F1/08; C25D7/00; C25D7/12; H01B1/02; H01B5/02; C22F1/00
Foreign References:
JP2013104101A2013-05-30
JP2013095943A2013-05-20
JP2011241412A2011-12-01
JP2010126777A2010-06-10
JP2009007666A2009-01-15
JP2013204079A2013-10-07
JPH0718354A1995-01-20
JP5045783B22012-10-10
Other References:
See also references of EP 3081660A4
KOYA NOMURA: "Technical Trends in High Performance Copper Alloy Strip for Connector and Kobe Steel's Development Strategy", KOBE STEEL WORKS ENGINEERING REPORTS, vol. 54, no. 1, 2004, pages 2 - 8
SHIGENORI HORI ET AL.: "Intergranular (grain boundary) precipitation in a Cu-Mg alloy", JOURNAL OF THE JAPAN COPPER AND BRASS RESEARCH ASSOCIATION, vol. 19, 1980, pages 115 - 124
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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