COPPER ALLOY FOR ELECTRICAL AND ELECTRONIC EQUIPMENT, COPPER ALLOY THIN SHEET FOR ELECTRICAL AND ELECTRONIC EQUIPMENT, AND CONDUCTIVE PART AND TERMINAL FOR ELECTRICAL AND ELECTRONIC EQUIPMENT

WIPO Patent Application WO/2014/104198

A1

The present invention pertains to a copper alloy for electrical and electronic equipment, a copper alloy thin sheet for electrical and electronic equipment, and a conductive part and terminal for electrical and electronic equipment. The copper alloy for electrical and electronic equipment contains more than 2.0 mass% to 15.0 mass% of zinc, 0.10 mass% to 0.90 mass% of tin, 0.05 mass% to less than 1.00 mass% of nickel, 0.001 mass% to less than 0.100 mass% of iron, and 0.005 mass% to 0.100 mass% of phosphorus, with the remainder comprising copper and unavoidable impurities. The copper alloy satisfies 0.002 ≤ Fe/Ni < 1.500, 3.0 < (Ni + Fe)/P < 100.0, and 0.10 < Sn/(Ni + Fe) < 5.00 in terms of atomic ratios. The yield ratio (YS/TS), which is calculated from the tensile strength (TS) and 0.2% offset yield strength (YS) when a tension test is performed in a direction parallel to the rolling direction, is over 90%.

MAKI KAZUNARI (JP)
MORI HIROYUKI (JP)
YAMASHITA DAIKI (JP)

PCT/JP2013/084903

July 03, 2014

December 26, 2013

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MITSUBISHI MATERIALS CORP (JP)
MITSUBISHI SHINDO KK (JP)

C22C9/04; H01B1/02; H01B5/02; C22F1/00; C22F1/08

JP2002530523A	2002-09-17
JP2012158829A	2012-08-23
JPS63161134A	1988-07-04
JPH0533087A	1993-02-09
JP2006283060A	2006-10-19
JPH0533087A	1993-02-09
JP2006283060A	2006-10-19
JP3953357B2	2007-08-08
JP3717321B2	2005-11-16

See also references of EP 2940166A4

SHIGA Masatake et al. (JP)
Masatake Shiga (JP)

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