Title:
COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICE, AND COPPER ALLOY ROLLED MATERIAL FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/142428
Kind Code:
A1
Abstract:
Disclosed is a copper alloy for an electronic device containing Mg in a range of 2.6 - 9.8 atomic percent and Al in a range of 0.1 - 20 atomic percent with the with the remainder being substantially Cu and inevitable impurities.
Inventors:
ITO Yuki (Central Research Institute Metal Processing Laboratory, 1975-2, Shimoishitokami, Kitamoto-sh, Saitama 22, 〒3640022, JP)
伊藤 優樹 (〒22 埼玉県北本市下石戸上１９７５－２ 三菱マテリアル株式会社中央研究所 金属加工プロセス開発センター内 Saitama, 〒3640022, JP)
伊藤 優樹 (〒22 埼玉県北本市下石戸上１９７５－２ 三菱マテリアル株式会社中央研究所 金属加工プロセス開発センター内 Saitama, 〒3640022, JP)
Application Number:
JP2011/060962
Publication Date:
November 17, 2011
Filing Date:
May 12, 2011
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORPORATION (3-2 Otemachi 1-chome, Chiyoda-ku Tokyo, 17, 〒1008117, JP)
三菱マテリアル株式会社 (〒17 東京都千代田区大手町一丁目３番２号 Tokyo, 〒1008117, JP)
ITO Yuki (Central Research Institute Metal Processing Laboratory, 1975-2, Shimoishitokami, Kitamoto-sh, Saitama 22, 〒3640022, JP)
三菱マテリアル株式会社 (〒17 東京都千代田区大手町一丁目３番２号 Tokyo, 〒1008117, JP)
ITO Yuki (Central Research Institute Metal Processing Laboratory, 1975-2, Shimoishitokami, Kitamoto-sh, Saitama 22, 〒3640022, JP)
International Classes:
C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/06; C22C9/10; C22F1/08; H01B1/02; H01B5/02; H01B13/00; H01R13/03; C22F1/00; C22F1/02
Attorney, Agent or Firm:
SHIGA Masatake et al. (1-9-2, MarunouchiChiyoda-ku, Tokyo 20, 〒1006620, JP)
Download PDF:
Claims: