Title:
COPPER ALLOY FOR ELECTRONIC DEVICES, METHOD OF MANUFACTURING COPPER ALLOY FOR ELECTRONIC DEVICES, COPPER ALLOY PLASTIC WORKING MATERIAL FOR ELECTRONIC DEVICES, AND COMPONENT FOR ELECTRONIC DEVICES
Document Type and Number:
WIPO Patent Application WO/2013/069687
Kind Code:
A1
Abstract:
Provided is a copper alloy for electronic devices which has a low Young's modulus, high proof stress, high conductivity and excellent bending workability, and which is suitable for electronic device components such as terminals, connectors, relays, and lead frames; also provided are a method of manufacturing the copper alloy for electronic devices, a copper alloy plastic working material for electronic devices, and a component for electronic devices. This copper alloy contains 3.3-6.9 atom% Mg, the rest being substantially Cu and unavoidable impurities. Setting X to the Mg concentration in atom%, the conductivity σ (%IACS) is in the range σ ≦ {1.7241 / (-0.0347×X2 + 0.6569×X + 1.7)} ×100, and the average crystal particle diameter is in the range 1-100μm. Further, after intermediate heat treatment, the average crystal particle diameter in the copper material before finish processing is in the range 1-100μm.
Inventors:
ITO YUKI (JP)
MAKI KAZUNARI (JP)
MAKI KAZUNARI (JP)
Application Number:
PCT/JP2012/078851
Publication Date:
May 16, 2013
Filing Date:
November 07, 2012
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; B21B3/00; C22F1/08; H01B1/02; H01B5/02; H01B13/00; C22F1/00
Domestic Patent References:
| WO2011104982A1 | 2011-09-01 |
Foreign References:
| JP2012251226A | 2012-12-20 | |||
| JPH1136055A | 1999-02-09 | |||
| JPH0718354A | 1995-01-20 |
Other References:
See also references of EP 2778240A4
KOYA NOMURA: "Technical Trends in High Performance Copper Alloy Strip for Connector and Kobe Steel's Development Strategy", KOBE STEEL ENGINEERING REPORTS, vol. 54, no. 1, 2004, pages 2 - 8
SHIGENORI HORI: "Intergranular (Grain Boundary) Precipitation in Cu-Mg Alloy", JOURNAL OF THE JAPAN COPPER AND BRASS RESEARCH ASSOCIATION, vol. 19, 1980, pages 115 - 124
KOYA NOMURA: "Technical Trends in High Performance Copper Alloy Strip for Connector and Kobe Steel's Development Strategy", KOBE STEEL ENGINEERING REPORTS, vol. 54, no. 1, 2004, pages 2 - 8
SHIGENORI HORI: "Intergranular (Grain Boundary) Precipitation in Cu-Mg Alloy", JOURNAL OF THE JAPAN COPPER AND BRASS RESEARCH ASSOCIATION, vol. 19, 1980, pages 115 - 124
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
Download PDF:
Claims: