Title:
COPPER ALLOY FOR ELECTRONIC OR ELECTRICAL DEVICE, COPPER ALLOY THIN SHEET FOR ELECTRONIC OR ELECTRICAL DEVICE, PROCESS FOR MANUFACTURING COPPER ALLOY FOR ELECTRONIC OR ELECTRICAL DEVICE, CONDUCTIVE COMPONENT FOR ELECTRONIC OR ELECTRICAL DEVICE, AND TERMINAL
Document Type and Number:
WIPO Patent Application WO/2014/109083
Kind Code:
A1
Abstract:
A copper ally for an electronic or electrical device, containing more than 2.0 to 36.5 mass% of Zn, 0.1 to 0.9 mass% of Sn, 0.05 to less than 1.0 mass% of Ni, 0.5 to less than 10 mass ppm of Fe, 0.001 to less than 0.10 mass% of Co, and 0.001 to 0.10 mass% of P with the balance consisting of Cu and unavoidable impurities, satisfying the relationships among the contents of these elements in atomic ratio, 0.002 ≤ Fe/Ni < 1.5, 3 < (Ni+Fe)/P < 15 and 0.3 < Sn/(Ni+Fe) < 5, and containing a precipitate that contains both P and at least one element selected from the group consisting of Fe, Co and Ni.
Inventors:
MAKI KAZUNARI (JP)
MORI HIROYUKI (JP)
YAMASHITA DAIKI (JP)
MORI HIROYUKI (JP)
YAMASHITA DAIKI (JP)
Application Number:
PCT/JP2013/068834
Publication Date:
July 17, 2014
Filing Date:
July 10, 2013
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
MITSUBISHI SHINDO KK (JP)
MITSUBISHI SHINDO KK (JP)
International Classes:
C22C9/04; C22F1/08; C25D7/00; H01B1/02; H01B5/02; H01B13/00; C22F1/00
Domestic Patent References:
| WO2010134210A1 | 2010-11-25 | |||
| WO2012026610A1 | 2012-03-01 |
Foreign References:
| JP2007084920A | 2007-04-05 | |||
| JP2011184775A | 2011-09-22 | |||
| JPH0533087A | 1993-02-09 | |||
| JP2006283060A | 2006-10-19 | |||
| JP3953357B2 | 2007-08-08 | |||
| JP3717321B2 | 2005-11-16 |
Other References:
SUZUKI SEIICHI: "EBSD guide: when using OIM (3rd revised edition)", September 2009, TSL SOLUTIONS K.K.
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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