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Title:
COPPER ALLOY FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, COPPER ALLOY PLATE STRIP FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, COMPONENT FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, TERMINAL, BUSBAR, AND MOVABLE PIECE FOR RELAYS
Document Type and Number:
WIPO Patent Application WO/2017/170699
Kind Code:
A1
Abstract:
The present invention is characterized by: including at least 0.15 mass% and less than 0.35 mass% Mg and at least 0.0005 mass% and less than 0.01 mass% P, with the remainder being Cu and unavoidable impurities; the conductivity exceeding 75% IACS; and the average number of compounds containing Mg and P having a particle diameter of at least 0.1 µm, as observed using a scanning electron microscope, being no more than 0.5/µm2.

Inventors:
MATSUNAGA HIROTAKA (JP)
MAKI KAZUNARI (JP)
Application Number:
PCT/JP2017/012914
Publication Date:
October 05, 2017
Filing Date:
March 29, 2017
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22F1/08; H01B1/02; H01B5/02; H01H50/14; H01H50/56; H01R4/58; H01R13/03; C22F1/00
Foreign References:
JP2014025089A2014-02-06
JPH05311283A1993-11-22
JP2015048503A2015-03-16
JP2015101773A2015-06-04
JP5910790B12016-04-27
Other References:
See also references of EP 3438298A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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