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Title:
COPPER ALLOY FOIL
Document Type and Number:
WIPO Patent Application WO/2018/034184
Kind Code:
A1
Abstract:
The purpose of the present invention is to address the problem set forth in the description, by providing a copper alloy foil that exhibits both electrical conductivity and heat resistance. The present invention also provides a copper alloy foil that, when used for the negative electrode current collector of a secondary battery, exhibits an improved adherence to the active substance layer. The copper alloy foil contains 0.005 to 0.015 wt% Sn and has an oxygen content of not more than 0.0020 wt% with the remainder comprising Cu and unavoidable impurities. An Sn-rich layer is formed in at least one of the surface layers of the copper alloy foil.

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Inventors:
NAKANO JUNSUKE (JP)
HOSHINO TOSHIYUKI (JP)
Application Number:
PCT/JP2017/028576
Publication Date:
February 22, 2018
Filing Date:
August 07, 2017
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
UACJ FOIL CORP (JP)
International Classes:
C22C9/02; H01M4/66; C22F1/00; C22F1/02; C22F1/08
Foreign References:
JP2013247017A2013-12-09
JP2000303128A2000-10-31
JP2002363669A2002-12-18
JP2012243454A2012-12-10
JP2013054866A2013-03-21
JP2011108442A2011-06-02
Other References:
See also references of EP 3502287A4
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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