Title:
COPPER ALLOY HAVING HIGH STRENGTH AND HIGH ELECTRICAL CONDUCTIVITY CHARACTERISTICS FOR ELECTRICAL AND ELECTRONIC COMPONENT AND SEMICONDUCTOR, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/088419
Kind Code:
A1
Abstract:
The present invention relates to a copper alloy having high strength and high electrical conductivity characteristics for an electrical and electronic component and a semiconductor and to a method for manufacturing the same. The copper alloy according to the present invention contains, in mass%, 0.09-0.20% of iron (Fe), 0.05-0.09% of phosphorus (P), 0.05-0.20% of manganese (Mn), and the remainder being copper (Cu) and 0.05 mass% or less of unavoidable impurities, wherein the copper alloy has a tensile strength of 470 MPa or greater, a hardness of 145 Hv or more, an electrical conductivity of 75% IACS or more, and a softening resistance temperature of 400°C or higher.
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Inventors:
KWAK WON SHIN (KR)
JEONG MIN JAE (KR)
CHOI JUN YOUNG (KR)
JEONG MIN JAE (KR)
CHOI JUN YOUNG (KR)
Application Number:
PCT/KR2018/009428
Publication Date:
May 09, 2019
Filing Date:
August 17, 2018
Export Citation:
Assignee:
POONGSAN CORP (KR)
International Classes:
C22C9/00; B21B3/00; C22F1/08
Foreign References:
| JP2000328157A | 2000-11-28 | |||
| KR20070031438A | 2007-03-19 | |||
| KR20130136183A | 2013-12-12 | |||
| KR20110091973A | 2011-08-17 | |||
| KR20080019274A | 2008-03-03 |
Attorney, Agent or Firm:
KIM, Yong In et al. (KR)
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