Title:
COPPER ALLOY IRREGULAR-SHAPE STRIP, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICES, TERMINAL, BUSBAR, LEAD FRAME, AND HEAT DISSIPATION SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/127851
Kind Code:
A1
Abstract:
Provided is a copper alloy irregular-shape strip having, in a cross-sectional view orthogonal to the longitudinal direction, portions with different thicknesses, i.e., a thick section and a thin section. The copper alloy irregular-shape strip has: a composition in which the Mg content is in the range from greater than 10 mass ppm to less than 1.2 mass% and the P content is in the range of 0 mass ppm to 200 mass ppm, with the remainder being Cu and unavoidable impurities; and an electroconductivity of 48% IACS or more. The thick section has a heat resistance temperature T1 of 260°C or more, and the thin section has a heat resistance temperature T2 of 240°C, where 0.9 is 1% or more in both the thick section and the thin section. The copper alloy irregular-shape strip has high electroconductivity and excellent heat resistance.
Inventors:
MATSUNAGA HIROTAKA (JP)
MORIKAWA KENJI (JP)
FUNAKI SHINICHI (JP)
FUKUOKA KOSEI (JP)
ITO YUKI (JP)
MAKI KAZUNARI (JP)
MORIKAWA KENJI (JP)
FUNAKI SHINICHI (JP)
FUKUOKA KOSEI (JP)
ITO YUKI (JP)
MAKI KAZUNARI (JP)
Application Number:
PCT/JP2022/048113
Publication Date:
July 06, 2023
Filing Date:
December 27, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22F1/00; C22F1/08
Domestic Patent References:
WO2021117698A1 | 2021-06-17 | |||
WO2020203576A1 | 2020-10-08 |
Foreign References:
JP2003136103A | 2003-05-14 | |||
JP2021055129A | 2021-04-08 | |||
JP2020128598A | 2020-08-27 | |||
JP2022072355A | 2022-05-17 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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