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Title:
COPPER ALLOY IRREGULAR-SHAPE STRIP, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICES, TERMINAL, BUSBAR, LEAD FRAME, AND HEAT DISSIPATION SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/127851
Kind Code:
A1
Abstract:
Provided is a copper alloy irregular-shape strip having, in a cross-sectional view orthogonal to the longitudinal direction, portions with different thicknesses, i.e., a thick section and a thin section. The copper alloy irregular-shape strip has: a composition in which the Mg content is in the range from greater than 10 mass ppm to less than 1.2 mass% and the P content is in the range of 0 mass ppm to 200 mass ppm, with the remainder being Cu and unavoidable impurities; and an electroconductivity of 48% IACS or more. The thick section has a heat resistance temperature T1 of 260°C or more, and the thin section has a heat resistance temperature T2 of 240°C, where 0.9 is 1% or more in both the thick section and the thin section. The copper alloy irregular-shape strip has high electroconductivity and excellent heat resistance.

Inventors:
MATSUNAGA HIROTAKA (JP)
MORIKAWA KENJI (JP)
FUNAKI SHINICHI (JP)
FUKUOKA KOSEI (JP)
ITO YUKI (JP)
MAKI KAZUNARI (JP)
Application Number:
PCT/JP2022/048113
Publication Date:
July 06, 2023
Filing Date:
December 27, 2022
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22F1/00; C22F1/08
Domestic Patent References:
WO2021117698A12021-06-17
WO2020203576A12020-10-08
Foreign References:
JP2003136103A2003-05-14
JP2021055129A2021-04-08
JP2020128598A2020-08-27
JP2022072355A2022-05-17
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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