Title:
COPPER ALLOY MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2011/019042
Kind Code:
A1
Abstract:
Disclosed is a copper alloy material for electrical/electronic components in which an alloy layer containing at least copper and tin is formed on a substrate comprising copper or copper alloy, wherein the area ratio of the region of the substrate which is within 20º from the cube orientation {001}<100> in a crystal orientation measurement using the EBSD method is 5% or more.
Inventors:
KANEKO, Hiroshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
金子 洋 (〒22 東京都千代田区丸の内２丁目２番３号 古河電気工業株式会社内 Tokyo, 〒1008322, JP)
金子 洋 (〒22 東京都千代田区丸の内２丁目２番３号 古河電気工業株式会社内 Tokyo, 〒1008322, JP)
Application Number:
JP2010/063587
Publication Date:
February 17, 2011
Filing Date:
August 10, 2010
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO., LTD. (2-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 22, 〒1008322, JP)
古河電気工業株式会社 (〒22 東京都千代田区丸の内２丁目２番３号 Tokyo, 〒1008322, JP)
KANEKO, Hiroshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
古河電気工業株式会社 (〒22 東京都千代田区丸の内２丁目２番３号 Tokyo, 〒1008322, JP)
KANEKO, Hiroshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
International Classes:
C22C9/06; C22C9/00; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/08; C25D5/10; C25D5/12; C25D7/00; H01B5/02; H01B13/00; H01R13/03; C22F1/00
Attorney, Agent or Firm:
IIDA, Toshizo et al. (ISHII Bldg. 3F, 1-10 Shimbashi 3-chome, Minato-k, Tokyo 04, 〒1050004, JP)