COPPER ALLOY MATERIAL, CONNECTOR TERMINAL, AND METHOD FOR PRODUCING COPPER ALLOY MATERIAL

Title:

COPPER ALLOY MATERIAL, CONNECTOR TERMINAL, AND METHOD FOR PRODUCING COPPER ALLOY MATERIAL

Document Type and Number:

WIPO Patent Application WO/2016/051864

Kind Code:

A1

Abstract:

This copper alloy material contains Cu and Fe, and is composed of a Cu-Fe alloy. The Fe content in this copper alloy material is from 20% by mass to 50% by mass (inclusive). This copper alloy material has a structure that contains a Cu phase and an Fe phase, and the half-value width of the diffraction peak of the (222) plane of the Cu phase and the half-value width of the diffraction peak of the (220) plane of the Fe phase in X-ray diffraction are 0.5 or less. This copper alloy material is able to be produced through: a preparation step wherein a material for Cu-Fe alloy, which contains from 20% by mass to 50% by mass (inclusive) of Fe, is prepared; a processing step wherein a processed material in the final shape is produced by subjecting the material to plastic forming; and a final heat treatment step wherein the processed material is subjected to a heat treatment at a temperature from 500°C to 600°C (inclusive) after the processing step.

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Inventors:

MUNEKATA TERUYOSHI (JP)
SHIMIZU KENICHI (JP)
TAKAMURA SHINEI (JP)
MIYOSHI YASUHITO (JP)
IZUMIDA HIROMU (JP)
IWAMOTO KATSUTOSHI (JP)
FURUKAWA KINGO (JP)

Application Number:

PCT/JP2015/065889

Publication Date:

April 07, 2016

Filing Date:

June 02, 2015

Export Citation:

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Assignee:

SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
AUTONETWORKS TECHNOLOGIES LTD (JP)

International Classes:

C22C9/00; C22F1/08; H01B1/02; C22F1/00

Domestic Patent References:

WO2015111455A1

2015-07-30

Foreign References:

JPH05214489A	1993-08-24
JPS63137148A	1988-06-09
JPS63162829A	1988-07-06
JP2013142178A	2013-07-22
JP2006219705A	2006-08-24
JPS3514511B1

Attorney, Agent or Firm:

Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)

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