COPPER ALLOY MATERIAL AND MANUFACTURING METHOD THEREFOR

Title:

COPPER ALLOY MATERIAL AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2010/134210

Kind Code:

A1

Abstract:

A copper alloy plate material having a composition of 0.1 to 5 mass% Ni, 0.1 to 5 mass% Sn, and 0.01 to 0.5 mass% P with the balance consisting of Cu and unavoidable impurities has a crystal orientation that satisfies 2.9 ≦ (f{220} + f{311} + f{420})/(0.27·f{220} + 0.49 f{311} + 0.49·f{420}) ≦ 4.0 when the orientation of the {hk1} crystal face at the rolled surface of the copper alloy plate material measured by powder X-ray diffraction method is f{hk1}.

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Inventors:

AOYAMA TOMOTSUGU (JP)
SUGAWARA AKIRA (JP)

Application Number:

PCT/JP2009/059732

Publication Date:

November 25, 2010

Filing Date:

May 21, 2009

Export Citation:

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Assignee:

DOWA METALTECH CO LTD (JP)
AOYAMA TOMOTSUGU (JP)
SUGAWARA AKIRA (JP)

International Classes:

C22C9/06; C22C9/02; C22F1/08; C22F1/00

Foreign References:

JP2008231492A	2008-10-02
JP2009035775A	2009-02-19
JP2007270300A	2007-10-18

Attorney, Agent or Firm:

OKAWA, KOICHI (JP)
Koichi Okawa (JP)

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Claims:

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