COPPER ALLOY MATERIAL FOR ELECTRICAL/ELECTRONIC PART AND PROCESS FOR PRODUCING THE SAME

Title:

COPPER ALLOY MATERIAL FOR ELECTRICAL/ELECTRONIC PART AND PROCESS FOR PRODUCING THE SAME

Document Type and Number:

WIPO Patent Application WO/2008/044680

Kind Code:

A1

Abstract:

A copper alloy material obtained by finish-rolling a material at a rate of work of 40% or lower, subjecting the finish-rolled material to a heat treatment with a continuous annealing furnace at a temperature of 500-800°C for 1-100 seconds, and subjecting the heat-treated material to a stress relieving treatment at a temperature of 400-600°C for 30-1,000 seconds. The copper alloy material for electrical/electronic parts underwent a dimensional change through the stress relieving treatment in the range of -0.02% to +0.02% in each of the directions parallel and perpendicular to the rolling direction.

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Inventors:

NAKANO JUNSUKE (JP)
KITAZATO KEISUKE (JP)
HIRAI TAKAO (JP)

Application Number:

PCT/JP2007/069686

Publication Date:

April 17, 2008

Filing Date:

October 09, 2007

Export Citation:

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Assignee:

FURUKAWA ELECTRIC CO LTD (JP)
NAKANO JUNSUKE (JP)
KITAZATO KEISUKE (JP)
HIRAI TAKAO (JP)

International Classes:

B21B1/22; C22C9/06; B21B3/00; C22F1/08; H01B1/02; H01B5/02; H01B13/00; C22F1/00

Foreign References:

JP2004131829A	2004-04-30
JP2002317231A	2002-10-31
JP2001192793A	2001-07-17
JP2000282156A	2000-10-10
JPS6412539A	1989-01-17
JPH05109960A	1993-04-30
JP2003286527A	2003-10-10
JP2006276808A	2006-10-12
JP2007260386A	2007-10-11

Other References: