Title:
COPPER ALLOY MATERIAL AND COPPER ALLOY PIPE
Document Type and Number:
WIPO Patent Application WO/2015/122423
Kind Code:
A1
Abstract:
A copper alloy material containing 0.4%-3.5% by mass Ni and 0.1%-0.5% by mass P, with the remainder comprising Cu and unavoidable impurities. As a result of the present invention, a copper alloy material for a Cu-Ni-P-based plate material, rod material or copper alloy pipe, etc., having high strength and excellent workability can be provided.
Inventors:
NAGAI TAKESHI (JP)
TAMAGAWA HIROKAZU (JP)
SUZUKI SHINOBU (JP)
ASANO MINEO (JP)
TAMAGAWA HIROKAZU (JP)
SUZUKI SHINOBU (JP)
ASANO MINEO (JP)
Application Number:
PCT/JP2015/053738
Publication Date:
August 20, 2015
Filing Date:
February 12, 2015
Export Citation:
Assignee:
UACJ CORP (JP)
International Classes:
C22C9/06; C22C9/00; C22F1/08; C22F1/00
Domestic Patent References:
| WO2009098810A1 | 2009-08-13 |
Foreign References:
| JPS5126616A | 1976-03-05 | |||
| JPS52156720A | 1977-12-27 | |||
| JPH0222433A | 1990-01-25 | |||
| JPH04218631A | 1992-08-10 | |||
| JPH04231444A | 1992-08-20 | |||
| JPH08300119A | 1996-11-19 | |||
| JP2007039735A | 2007-02-15 |
Attorney, Agent or Firm:
AKATSUKA Kenji et al. (JP)
Kenji Akatsuka (JP)
Kenji Akatsuka (JP)
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