COPPER ALLOY MATERIAL, AND RESISTIVE MATERIAL FOR RESISTOR AND RESISTOR USING SAME

WIPO Patent Application WO/2023/276904

A1

Provided is a copper alloy material which, as, for example, a resistive material, has sufficiently high volume resistivity, and for which the absolute value of the thermoelectromotive force against copper is small and the resistance temperature coefficient over a wide temperature range from normal temperature (for example, 20°C) to a high temperature (for example, 150°C) is small, and the absolute value thereof is small. Also provided is a resistive material for a resistor and a resistor using said copper alloy material.　The copper alloy material contains: Mn, 20.0% to 35.0% by mass; Ni, 5.0% to 15.0% by mass; Fe, 0.01% to 0.50% by mass; and Co, 1.50% by mass or less (including a case in which the amount of Co is 0% by mass). The total amount of Fe and Co is in the range of 0.10% to 2.00% by mass, and the remainder is Cu and unavoidable impurities.

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KAWATA SHINGO (JP)
AKIYA SHUNTA (JP)
TAKAZAWA TSUKASA (JP)
AMEMIYA YUUTAROU (JP)

PCT/JP2022/025406

January 05, 2023

June 24, 2022

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FURUKAWA ELECTRIC CO LTD (JP)

C22C9/05; H01C3/00; H01C13/00; C22F1/00; C22F1/08

WO2021200326A1

2021-10-07

US3091527A	1963-05-28
CN112375938A	2021-02-19
CN101191165A	2008-06-04
JPS5641096A	1981-04-17

KURUMA Kiyoshi et al. (JP)

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