Title:
COPPER ALLOY MATERIAL, RESISTIVE MATERIAL FOR RESISTOR USING SAME, AND RESISTOR
Document Type and Number:
WIPO Patent Application WO/2023/276906
Kind Code:
A1
Abstract:
Provided is a copper alloy material which has excellent press punching workability and sufficiently high volume resistivity, and for which the temperature coefficient of resistance (TCR) is negative and has a small absolute value, and a copper thermoelectromotive force (EMF) has a small absolute value. Also provided are a resistive material for a resistor using the copper alloy material, and a resistor. The copper alloy material has an alloy composition containing: Mn, 20.0% by mass to 35.0% by mass; Ni, 5.0% by mass to 17.0% by mass; and one or both of Fe and Co, 0.10% by mass to 2.00% by mass in total, the remainder being Cu and unavoidable impurities. The Vickers hardness (HV) is in the range from 115 to 275.
Inventors:
KAWATA SHINGO (JP)
AKIYA SHUNTA (JP)
TAKAZAWA TSUKASA (JP)
AMEMIYA YUUTAROU (JP)
AKIYA SHUNTA (JP)
TAKAZAWA TSUKASA (JP)
AMEMIYA YUUTAROU (JP)
Application Number:
PCT/JP2022/025410
Publication Date:
January 05, 2023
Filing Date:
June 24, 2022
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C22C9/05; H01C3/00; H01C13/00; C22F1/00; C22F1/08
Domestic Patent References:
| WO2021200326A1 | 2021-10-07 |
Foreign References:
| US3091527A | 1963-05-28 | |||
| JPS5641096A | 1981-04-17 | |||
| CN101191165A | 2008-06-04 | |||
| JPS4114725B1 | 1966-08-19 | |||
| JPS644446A | 1989-01-09 |
Attorney, Agent or Firm:
KURUMA Kiyoshi et al. (JP)
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