Title:
COPPER ALLOY MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/081969
Kind Code:
A1
Abstract:
This copper alloy material comprises a composition including from 0.1 mass% to 1.5 mass% Cr, from 0.05 mass% to 0.25 mass% Zr, from 0.005 mass% to 0.10 mass% P, and Cu and inevitable impurities as the remainder, wherein: a Cr-Zr-P compound including Cr, Zr, and P is present; in a texture observation, the area percentage of the Cr-Zr-P compound is within a range from 0.5% to 5.0%; and the Cr-Zr-P compound has an acicular or granular form, wherein the length of the longest side is 100 µm or less.
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Inventors:
YANO SHOICHIRO (JP)
SATOU SHINOBU (JP)
SAKAMOTO TOSHIO (JP)
SATOU SHINOBU (JP)
SAKAMOTO TOSHIO (JP)
Application Number:
PCT/JP2016/080082
Publication Date:
May 18, 2017
Filing Date:
October 11, 2016
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22F1/08; C22F1/00
Foreign References:
JPH01309935A | 1989-12-14 | |||
JPH0570867A | 1993-03-23 | |||
JPS63143229A | 1988-06-15 | |||
CN102912178A | 2013-02-06 |
Other References:
See also references of EP 3375897A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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