COPPER ALLOY, COPPER ALLOY PLASTIC-PROCESSED MATERIAL, COMPONENT FOR ELECTRONIC AND ELECTRIC DEVICES, TERMINAL, BUS BAR, AND HEAT DISSIPATION SUBSTRATE

Title:

COPPER ALLOY, COPPER ALLOY PLASTIC-PROCESSED MATERIAL, COMPONENT FOR ELECTRONIC AND ELECTRIC DEVICES, TERMINAL, BUS BAR, AND HEAT DISSIPATION SUBSTRATE

Document Type and Number:

WIPO Patent Application WO/2021/107096

Kind Code:

A1

Abstract:

This copper alloy has a compositional makeup in which the contained amount of Mg is in the range of 70-400 mass ppm, the contained amount of Ag is in the range of 5-20 mass ppm, and the remaining portion is Cu and unavoidable impurities. The copper alloy contains P in an amount less than 3.0 mass ppm, has an electric conductivity of 90%IACS or more, and has a KAM average value of 3.0 or less.

Inventors:

MATSUNAGA HIROTAKA (JP)
ITO YUKI (JP)
MORI HIROYUKI (JP)
MATSUKAWA HIROYUKI (JP)

Application Number:

PCT/JP2020/044229

Publication Date:

June 03, 2021

Filing Date:

November 27, 2020

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP (JP)

International Classes:

C22F1/00; C22C9/00; C22F1/02; C22F1/08; H01B1/02

Domestic Patent References:

WO2019189558A1	2019-10-03
WO2019189534A1	2019-10-03

Foreign References:

JP2017179493A	2017-10-05
JP2019178399A	2019-10-17
JP2019178398A	2019-10-17
JP2019216549A	2019-12-19
JP2016056414A	2016-04-21

Other References: