Title:
COPPER ALLOY, PLASTIC WORKED COPPER ALLOY MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICES, TERMINAL, BUS BAR, LEAD FRAME, AND HEAT DISSIPATION SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/127854
Kind Code:
A1
Abstract:
Provided is a copper alloy that has a high electrical conductivity and an excellent heat resistance. This copper alloy has an Mg content of more than 10 mass-ppm but not more than 100 mass-ppm, with the balance being Cu and unavoidable impurities. The S content is 10 mass-ppm or less, the P content is 10 mass-ppm or less, the Se content is 5 mass-ppm or less, the Te content is 5 mass-ppm or less, the Sb content is 5 mass-ppm or less, the Bi content is 5 mass-ppm or less, the As content is 5 mass-ppm or less, and the total content of S, P, Se, Te, Sb, Bi, and As is 30 mass-ppm or less. The mass ratio [Mg]/[S + P + Se + Te + Sb + Bi + As] is 0.6 to 50, inclusive; the electrical conductivity is at least 97% IACS; the average value of the orientation density in the range of φ2 = 0°, φ1 = 0° to 20°, and Φ = 35° to 55° is at least 1.3 but less than 20.0; and the area proportion of crystals having a crystal orientation within 10° with respect to the {123}<634> S orientation is not more than 10%.
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Inventors:
MATSUNAGA HIROTAKA (JP)
MORIKAWA KENJI (JP)
FUNAKI SHINICHI (JP)
FUKUOKA KOSEI (JP)
ITO YUKI (JP)
MAKI KAZUNARI (JP)
MORIKAWA KENJI (JP)
FUNAKI SHINICHI (JP)
FUKUOKA KOSEI (JP)
ITO YUKI (JP)
MAKI KAZUNARI (JP)
Application Number:
PCT/JP2022/048118
Publication Date:
July 06, 2023
Filing Date:
December 27, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22F1/00; C22F1/08
Domestic Patent References:
| WO2021117698A1 | 2021-06-17 | |||
| WO2020203576A1 | 2020-10-08 |
Foreign References:
| JP2003136103A | 2003-05-14 | |||
| JP2021055129A | 2021-04-08 | |||
| JP2020128598A | 2020-08-27 | |||
| JP2022069413A | 2022-05-11 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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